MT46H64M16LFBF-6 IT:B Micron Technology Inc, MT46H64M16LFBF-6 IT:B Datasheet - Page 34

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MT46H64M16LFBF-6 IT:B

Manufacturer Part Number
MT46H64M16LFBF-6 IT:B
Description
64MX16 MOBILE DDR SDRAM PLASTIC IND TEMP GREEN VFBGA 1.8V
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT46H64M16LFBF-6 IT:B

Lead Free Status / RoHS Status
Compliant
PDF: 09005aef83d9bee4
1gb_ddr_mobile_sdram_t68m.pdf - Rev. E 12/10 EN
10. Clock frequency change is only permitted during clock stop, power-down, or self refresh
11.
12. Referenced to each output group: for x16, LDQS with DQ[7:0]; and UDQS with DQ[15:8].
13. DQ and DM input slew rates must not deviate from DQS by more than 10%. If the DQ/DM/
14. The transition time for input signals (CAS#, CKE, CS#, DM, DQ, DQS, RAS#, WE#, and ad-
15. These parameters guarantee device timing but are not tested on each device.
16. The valid data window is derived by achieving other specifications:
17.
18.
19.
20. Fast command/address input slew rate ≥1 V/ns. Slow command/address input slew rate
21. READs and WRITEs with auto precharge must not be issued until
22. The refresh period equals 64ms. This equates to an average refresh rate of 7.8125μs.
5. The CK/CK# input reference voltage level (for timing referenced to CK/CK#) is the point
6. A CK and CK# input slew rate ≥1 V/ns (2 V/ns if measured differentially) is assumed for
7. All AC timings assume an input slew rate of 1 V/ns.
8. CAS latency definition: with CL = 2, the first data element is valid at (
9. Timing tests may use a V
tion tools for system design validation is suggested.
at which CK and CK# cross; the input reference voltage level for signals other than CK/
CK# is V
all parameters.
clock at which the READ command was registered; for CL = 3, the first data element is
valid at (2 ×
timing is still referenced to V
ing reference voltage level is V
mode.
t
next highest integer.
For x32, DQS0 with DQ[7:0]; DQS1 with DQ[15:8]; DQS2 with DQ[23:16]; and DQS3 with
DQ[31:24].
DQS slew rate is less than 1.0 V/ns, timing must be derated: 50ps must be added to
and
tionality is uncertain.
dresses) are measured between V
V
and
duty cycle and a practical data valid window can be derived. The clock is provided a max-
imum duty cycle variation of 45/55. Functionality is uncertain when operating beyond a
45/55 ratio.
t
CK# inputs, collectively.
t
These parameters are not referenced to a specific voltage level, but specify when the
device output is no longer driving (
t
≥0.5 V/ns. If the slew rate is less than 0.5 V/ns, timing must be derated:
tional 50ps per each 100 mV/ns reduction in slew rate from the 0.5 V/ns.
added, therefore, it remains constant. If the slew rate exceeds 4.5 V/ns, functionality is
uncertain.
fied prior to the internal PRECHARGE command being issued.
DAL = (
HP (MIN) is the lesser of
HZ and
HZ (MAX) will prevail over
IL(AC)
I/O
t
t
Full drive strength
DH for each 100 mV/ns reduction in slew rate. If the slew rate exceeds 4 V/ns, func-
QH (
for falling input signals.
DDQ/2
t
t
WR/
LZ transitions occur in the same access time windows as valid data transitions.
t
HP -
50
t
t
.
CK +
CK) + (
Electrical Specifications – AC Operating Conditions
t
QHS). The data valid window derates directly proportional with the clock
t
AC) after the first clock at which the READ command was registered.
t
RP/
20pF
t
CK): for each term, if not already an integer, round up to the
IL
t
CL (MIN) and
-to-V
34
t
DQSCK (MAX) +
DDQ/2
I/O
IH
DDQ/2
swing of up to 1.5V in the test environment, but input
IL(DC)
Half drive strength
or to the crossing point for CK/CK#. The output tim-
1Gb: x16, x32 Mobile LPDDR SDRAM
t
.
HZ) or begins driving (
Micron Technology, Inc. reserves the right to change products or specifications without notice.
to V
t
CH (MIN) actually applied to the device CK and
50
IH(AC)
t
RPST (MAX) condition.
for rising input signals and V
10pF
t
LZ).
© 2009 Micron Technology, Inc. All rights reserved.
t
RAS (MIN) can be satis-
t
HP (
t
CK +
t
IS has an addi-
t
t
CK/2),
IH has 0ps
t
AC) after the
IH(DC)
t
DQSQ,
to
t
DS

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