MPC8314ECVRADDA Freescale Semiconductor, MPC8314ECVRADDA Datasheet - Page 96

• Manufacturer Part Number: MPC8314ECVRADDA
• Description: MPU POWERQUICC II PRO 620-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8314ECVRADDA

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 266MHz
• Voltage: 1V
• Mounting Type: Surface Mount
• Package / Case: 620-PBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Thermal (Preliminary)
24 Thermal (Preliminary)
This section describes the thermal specifications of the MPC8314E.
24.1
Table 74
96
Junction to ambient natural convection
Junction to ambient natural convection
Junction to ambient (@200 ft/min)
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to package top
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
Conf. No.
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
on the top surface of the board near the package.
Method 1012.1).
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
as Psi-JT.
3
4
5
6
7
8
9
provides the package thermal characteristics for the 620 29 × 29 mm TEPBGA II.
Thermal Characteristics
Characteristic
SPMF
0010
0100
0101
0010
0101
0100
0010
MPC8314E PowerQUICC
Core\PLL
0000100
0000101
0000101
0000101
0000110
0000110
0000110
Table 74. Package Thermal Characteristics for TEPBGA II
Table 73. Suggested PLL Configurations
Input Clock Frequency (MHz) CSB Frequency (MHz) Core Frequency (MHz)
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
™
II Pro Processor Hardware Specifications, Rev. 0
66.67
33.33
66.67
33.33
66.67
25
25
Board type
—
—
Symbol
133.33
133.33
133.33
133.33
133.33
R
R
R
R
R
R
Ψ
125
125
θJMA
θJMA
θJC
θJA
θJA
θJB
JT
Value
23
16
18
13
8
6
6
Freescale Semiconductor
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
266.66
333.33
333.33
Unit
312.5
375
400
400
1, 2, 3
Notes
1, 2
1, 3
1, 3
4
5
6