MC68LC060RC50 Freescale Semiconductor, MC68LC060RC50 Datasheet - Page 359

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MC68LC060RC50

Manufacturer Part Number
MC68LC060RC50
Description
IC MPU 32BIT 68K 50MHZ 206-PGA
Manufacturer
Freescale Semiconductor
Datasheets

Specifications of MC68LC060RC50

Processor Type
M680x0 32-Bit
Speed
50MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
206-PGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ordering Information and Mechanical Data
13-5
MC68060 CQFP
CASE NUMBER: 994-01
SEATING
PLANE
DETAIL "A"
DIM
C
AB
AA
R
U
V
Z
F
G
W
P
S
Y
A
B
C
D
E
J
K
U
2
1
C
26.86
26.86
E
0.18
MIN
3.00
0.17
0.12
0.25
0.13
0.45
MILLIMETERS
.0.50 BSC
30.60 BSC
15.30 BSC
15.30 BSC
30.60 BSC
15.30 BSC
0.15 REF
1.80 REF
0.25 BSC
0.95 REF
P
W
A, B, D
27.75
27.75
MAX
0.18
0.55
4.15
0.27
3.70
0.23
0.13
Figure 13-2. QFP Package Dimensions (FE Suffix)
V
1.057
1.057
MIN
0.007
0.005
0.007
0.118
0.010
0.018
0.005
Y
BASE METAL
G
1.205 BSC
0.602 BSC
1.205 BSC
0.602 BSC
0.010 BSC
0.071 REF
0.602 BSC
0.037 REF
0.006 REF
INCHES
0.020 BSC
A
MAX
.1.093
.1.093
0.005
0.007
0.022
0.163
0.011
0.146
0.009
157
208
J
156
DETAIL "B"
1
M68060 USER’S MANUAL
F
D
DETAIL "B"
D
U
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER. INCHES ARE IN "(
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS
4. DATUMS -A-, -B-, AND -D- TO BE DETERMINED AT DATUM PLANE -H- .
5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -C-.
6. DIMENSIONS A AND B DEFINE MAXIMUM CERAMIC BODY DIMENSIONS
A
Z
S
COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE
PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE.
INCLUDING GLASS PROTRUSION AND MISMATCH OF CERAMIC BODY
TOP AND BOTTOM.
DETAIL "A"
0.13 (0.005)
52
105
M
104
53
C A – B
4 x 52 TIPS
B
DATUM
H
0.20 (0.008)
PLANE
DETAIL "C"
S
0.20 (0.008)
B
0.1 (0.004 )
DATUM
PLANE
D
S
H
H
M
A – B
H
A – B
S
AB
D
S
S
AA
D
DETAIL "C"
S
)".
K
MOTOROLA
R
1
R
2

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