MC68LC060RC50 Freescale Semiconductor, MC68LC060RC50 Datasheet - Page 63

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MC68LC060RC50

Manufacturer Part Number
MC68LC060RC50
Description
IC MPU 32BIT 68K 50MHZ 206-PGA
Manufacturer
Freescale Semiconductor
Datasheets

Specifications of MC68LC060RC50

Processor Type
M680x0 32-Bit
Speed
50MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
206-PGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Signal Description
2.11.4 Test Data In (TDI)
This input signal provides a serial data input to the TAP. TDI should be tied to V
if it is not
CC
used and emulation mode is not to be used.
2.11.5 Test Data Out (TDO)
This three-state output signal provides a serial data output from the TAP. The TDO output
can be placed in a high-impedance mode to allow parallel connection to board-level test
data paths.
2.11.6 Test Reset (TRST)
This input signal provides an asynchronous reset of the TAP controller. TRST should be
grounded if 1149.1 operation is not to be used.
2.12 THERMAL SENSING PINS (THERM1, THERM0)
THERM1 and THERM0 are connected to an internal thermal resistor and provide informa-
tion about the average temperature of the die. The resistance across these two pins is pro-
portional to the average temperature of the die. The temperature coefficient of the resistor
is approximately 1.2 / C with a nominal resistance of 400 at 25 C.
2.13 POWER SUPPLY CONNECTIONS
The MC68060 requires connection to a V
power supply, positive with respect to ground.
CC
The V
and ground connections are grouped to supply adequate current to the various
CC
sections of the processor. Section 13 Ordering Information and Mechanical Data
describes the groupings of the V
and ground connections.
CC
2.14 SIGNAL SUMMARY
Table 2-8 provides a summary of the electrical characteristics of the MC68060 signals.
MOTOROLA
M68060 USER’S MANUAL
2-17

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