TMP86C993XB(EYZ) Toshiba, TMP86C993XB(EYZ) Datasheet - Page 241

• Manufacturer Part Number: TMP86C993XB(EYZ)
• Description: EMULATION CHIP FOR TMP86F SSOP
• Manufacturer: Toshiba
• Series: -r

Specifications of TMP86C993XB(EYZ)

• Accessory Type: Adapter
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: TMP86F SSOP
• Other names: TMP86C993XB; TMP86C993XB

21.9
21.10
Note 1: To ensure stable oscillation, the resonator position, load capacitance, etc. must be appropriate. Because these factors
Note 2: The product numbers and specifications of the resonators by Murata Manufacturing Co., Ltd. are subject to change.
Oscillating Conditions
-
-
Handling Precaution
are greatly affected by board patterns, please be sure to evaluate operation on the board on which the device will
actually be mounted.
For up-to-date information, please refer to the following URL:
http://www.murata.com
The solderability test conditions for lead-free products (indicated by the suffix G in product name) are shown
below.
When using the device (oscillator) in places exposed to high electric fields such as cathode-ray tubes, we
recommend electrically shielding the package in order to maintain normal operating condition.
1. When using the Sn-37Pb solder bath
Solder bath temperature = 230 °C
Dipping time = 5 seconds
Number of times = once
R-type flux used
2. When using the Sn-3.0Ag-0.5Cu solder bath
Solder bath temperature = 245 °C
Dipping time = 5 seconds
Number of times = once
R-type flux used
Note: The pass criterion of the above test is as follows: Solderability rate until forming ≥ 95%
C
(1) High-frequency Oscillation
1
XIN
XOUT
C
Page 227
2
C
(2) Low-frequency Oscillation
1
XTIN
XTOUT
C
2
TMP86FH92DMG