LPC2420_60 NXP Semiconductors, LPC2420_60 Datasheet - Page 49

no-image

LPC2420_60

Manufacturer Part Number
LPC2420_60
Description
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
9. Thermal characteristics
The average chip junction temperature, T
equation:
T
=
T
j
amb
T
amb
R
th(j-a)
P
D
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
Table 7.
Thermal characteristics
V
= 3.0 V to 3.6 V; T
=
40
DD
amb
Symbol
Parameter
T
maximum junction
j(max)
temperature
Table 8.
Thermal resistance value (C/W): ±15 %
V
= 3.0 V to 3.6 V; T
=
40
DD
amb
LQFP208
ja
JEDEC (4.5 in  4 in)
0 m/s
27.4
1 m/s
25.7
2.5 m/s
24.4
Single-layer (4.5 in  3 in)
0 m/s
35.4
1 m/s
31.2
2.5 m/s
29.2
jc
8.8
jb
15.4
LPC2420_60
Product data sheet
+
P
R
D
th j a
= ambient temperature (C),
= the package junction-to-ambient thermal resistance (C/W)
= sum of internal and I/O power dissipation
C to +85
C unless otherwise specified;
Conditions
C to +85
C unless otherwise specified;
TFBGA208
ja
JEDEC (4.5 in  4 in)
0 m/s
1 m/s
2.5 m/s
8-layer (4.5 in  3 in)
0 m/s
1 m/s
2.5 m/s
jc
jb
All information provided in this document is subject to legal disclaimers.
Rev. 6.1 — 22 September 2011
LPC2420/2460
Flashless 16-bit/32-bit microcontroller
(C), can be calculated using the following
j
and V
. The I/O power dissipation of
DD
DD
Min
Typ
Max
-
-
125
41
35
31
34.9
30.9
28
8.3
13.6
© NXP B.V. 2011. All rights reserved.
(1)
Unit
C
49 of 86

Related parts for LPC2420_60