mc68hc705v12 Freescale Semiconductor, Inc, mc68hc705v12 Datasheet - Page 209

• Manufacturer Part Number: mc68hc705v12
• Description: M68hc05-based Mcu Hc05 Freescale Semiconductor
• Manufacturer: Freescale Semiconductor, Inc

15.12.2 Power Dissipation
MC68HC705V12
—
Rev. 3.0
The minimum required V
V
equating the two
To keep the junction temperature to a minimum, the power consumed by
the gauge drivers must be factored into the chip power dissipation
equation. The total chip power dissipation combined with the thermal
resistance of the package cannot exceed the maximum junction
temperature, T
equation:
P
to the V
calculate P
The power dissipation contributed by the gauge module is given by this
equation:
Where
Where
GSUP
CHIP
V
V
P
P
P
P
[(V
•
Freescale Semiconductor, Inc.
GSUP(min)
GSUP(nom)
D
Chip
Gauge
GDrivers
For More Information On This Product,
GSUP(max)
= P
I
V
is the power contribution by all chip modules that are connected
GSUP
GSUP
DD
of
= (I
Gauge
= [V
and V
Chip
DD
=
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= the current consumed by the gauge module from the
V
pin for functions other than generating coil currents
= V
GSUP(nom)
GSUP(max)
x (1–T
, use this equation:
J
x V
+ P
. The total chip power dissipation is given by this
x I
DDA
GSUP(nom)
Gauge Drivers
DD
Coil(max)
Chip
) + (I
OL
sources including part of the gauge module. To
) = I
GSUP
=
X I
CCA
) – (I
I
Coil(max)
Coil(max)
GSUP
x (1–T
x V
must agree with the minimum generated
Coil(max)
] + P
CCA
OL
x [ R
x [R
)
)
GDrivers
(1 – T
2
Coil(max)
Coil(max)
x R
External Component Considerations
Coil(min)
OL
)
+ R
+ R
)] x 12 x SF
SI(max)
SI(max)
Advance Information
]
]
Gauge Drivers