S9S12G128F0VLL Freescale Semiconductor, S9S12G128F0VLL Datasheet - Page 1199

• Manufacturer Part Number: S9S12G128F0VLL
• Description: 16-bit Microcontrollers - MCU 16BIT 128K FLASH
• Manufacturer: Freescale Semiconductor

Specifications of S9S12G128F0VLL

• Rohs: yes
• Core: S12
• Processor Series: MC9S12G
• Data Bus Width: 16 bit
• Maximum Clock Frequency: 1 MHz
• Program Memory Size: 128 KB
• Data Ram Size: 8 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 3.13 V to 5.5 V
• Operating Temperature Range: - 40 C to + 125 C
• Package / Case: LQFP-100
• Mounting Style: SMD/SMT
• A/d Bit Size: 10 bit, 12 bit
• A/d Channels Available: 12
• Interface Type: SPI
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Number Of Programmable I/os: 86
• Number Of Timers: 8
• Program Memory Type: Flash
• Supply Voltage - Max: 5.5 V
• Supply Voltage - Min: 3.13 V

1
2
3
4
5
6
1
2
A.2
This section describes the characteristics of all I/O pins except EXTAL, XTAL, TEST, and supply pins.
Freescale Semiconductor
Conditions are 3.15 V < V
I/O Characteristics for all I/O pins except EXTAL, XTAL,TEST and supply pins.
Num C
The values for thermal resistance are achieved by package simulations
Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.J
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
.Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured in
simulation on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured in simulation by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per
JEDEC JESD51-2. Ψ
10
11
12
1
2
3
4
5
6
7
8
9
Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for each
8°C to 12 C ° in the temperature range from 50°C to 125°C.
Refer to
C Input hysteresis
C Output low voltage (pins in output mode)
D Input capacitance
P Input high voltage
T Input high voltage
P Input low voltage
T Input low voltage
P
P Output high voltage (pins in output mode)
P Internal pull up device current
P Internal pull down device current
T Injection current
Input leakage current (pins in high impedance input
mode)
+125°C to < T
+105°C to < T
–40°C to < T
V
V
Section A.1.4, “Current Injection”
I/O Characteristics
IH
IH
I OH = –1.75 mA
I OL = +1.75 mA
Single pin limit
Total device limit, sum of all injected currents
Table A-6. 3.3-V I/O Characteristics (Junction Temperature From –40°C To +150°C)
min > input voltage > V
min > input voltage > V
1
V in = V DD35 or V SS35
JT
J
J
J
< 105°C
is a useful value to use to estimate junction temperature in a steady state customer enviroment.
DD35
< 150°C
< 125°
2
< 3.6 V junction temperature from –40°C to +150°C, unless otherwise noted
Rating
IL
IL
MC9S12G Family Reference Manual, Rev.1.23
max
max
for more details
Symbol
V
I
V
I
V
I
I
V
V
PDH
V
V
PUL
C
ICS
ICP
HYS
I
OH
in
OL
IH
IH
IL
IL
in
V
V
0.65*V
0.06*V
SS35
DD35
–2.5
Min
-0.5
-0.4
–25
—
—
—
—
-1
-1
1
– 0.3
DD35
DD35
-0.4
Typ
—
—
—
—
—
—
—
—
—
—
—
—
—
7
Electrical Characteristics
0.35*V
V
0.3*V
DD35
Max
0.4
–70
0.5
0.4
2.5
70
25
—
—
—
—
1
DD35
+0.3
DD35
Unit
mV
mA
µA
µA
µA
pF
V
V
V
V
V
V
1201