S9S12G128F0VLL Freescale Semiconductor, S9S12G128F0VLL Datasheet - Page 1287

• Manufacturer Part Number: S9S12G128F0VLL
• Description: 16-bit Microcontrollers - MCU 16BIT 128K FLASH
• Manufacturer: Freescale Semiconductor

Specifications of S9S12G128F0VLL

• Rohs: yes
• Core: S12
• Processor Series: MC9S12G
• Data Bus Width: 16 bit
• Maximum Clock Frequency: 1 MHz
• Program Memory Size: 128 KB
• Data Ram Size: 8 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 3.13 V to 5.5 V
• Operating Temperature Range: - 40 C to + 125 C
• Package / Case: LQFP-100
• Mounting Style: SMD/SMT
• A/d Bit Size: 10 bit, 12 bit
• A/d Channels Available: 12
• Interface Type: SPI
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Number Of Programmable I/os: 86
• Number Of Timers: 8
• Program Memory Type: Flash
• Supply Voltage - Max: 5.5 V
• Supply Voltage - Min: 3.13 V

D.7
Bondpad Coordinates
Freescale Semiconductor
KGD Information
Die Pad
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
1
2
3
4
5
6
7
8
9
Bond Post
MC9S12G Family Reference Manual, Rev.1.23
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
1
2
3
4
5
6
7
8
9
Table D-1. Bondpad Coordinates
X Coordinate
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
Die Pad
-1707.5
-1506.5
Y Coordinate
-1472.06
-1472.06
Die Pad
-1054.5
-1196.5
-1347.5
1347.5
1223.5
1116.5
1009.5
-201.5
-311.5
-396.5
-483.5
-578.5
-683.5
-797.5
-921.5
902.5
795.5
688.5
603.5
496.5
241.5
136.5
-91.5
22.5
369
Function
RESET
VDDX1
VSSX1
VDDR
BKGD
PE[0]
VSS1
PE[1]
TEST
PB[0]
PB[1]
PB[2]
PA[0]
PA[1]
PA[2]
PA[3]
PA[4]
PA[5]
PA[6]
PA[7]
PJ[6]
PJ[5]
PJ[4]
PJ[0]
PJ[1]
PJ[2]
PJ[3]
Package and Die Information
1289