MC68EN360AI25VL Freescale, MC68EN360AI25VL Datasheet - Page 914
MC68EN360AI25VL
Manufacturer Part Number
MC68EN360AI25VL
Description
Manufacturer
Freescale
Datasheet
1.MC68EN360AI25VL.pdf
(962 pages)
Specifications of MC68EN360AI25VL
Family Name
M68000
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
25MHz
Instruction Set Architecture
RISC
Operating Supply Voltage (max)
3.3V
Operating Supply Voltage (min)
2.7V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
240
Package Type
FQFP
Lead Free Status / RoHS Status
Compliant
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Development Tools and Support
All modules communicate with each other using message passing. This technique simplifies
the interfaces between the different modules and enables them to interface with other user-
added modules with relative ease. Descriptions of the software interfaces are available.
Each module operates completely independent of its environment. Independence from the
hardware environment is achieved by the fact that each module is individually configurable
and relocatable anywhere in system memory. Calls are used for requesting resources or
services from the resident operating system (memory management and message passing),
which creates independence from the firmware. Modules may be used with any combination
of other modules, including those added by the user (see Figure B-1).
The chip driver module and simple driver module features are as follows:
B-2
• Provides all software modules with an interface to the QUICC
• Illustrates QUICC initialization and interrupt handling
• Provides complete configuration of the QUICC on system start (or restart)
• Provides services for the QUICC serial ports
LAYER 4
LAYER 3
LAYER 2
LAYER 1
LAPD MODULE
ACCESS TO THE
68360 IS
MADE THROUGH
THE DRIVER
USER-SUPPLIED
Freescale Semiconductor, Inc.
For More Information On This Product,
Figure B-1. Software Overview
MC68360 USER’S MANUAL
Go to: www.freescale.com
USER-SUPPLIED
DRIVER MODULE
MC68360
DEVICE
LAPB MODULE
MESSAGE PASSING IS THE ONLY FORM OF
INTERMODULE COMMUNICATION
MODULE
X.25
USER-SUPPLIED MODULES CAN BE
INTEGRATED AT ANY LEVEL
THE 68360 DOES SOME
ADDRESS RECOGNITION)
LAYER 2 FUNCTIONS (E.G.,
EDX REAL-TIME KERNEL
OR USER-SUPPLIED O.S.
USER-SUPPLIED
COMMUNICATES WITH
ALL MODULES BELOW
O.S. SUPPORT
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