RPIXP2850BB Intel, RPIXP2850BB Datasheet - Page 108

• Manufacturer Part Number: RPIXP2850BB
• Manufacturer: Intel

Specifications of RPIXP2850BB

• Operating Supply Voltage (typ): 1.3/1.5/2.5/3.3V
• Operating Supply Voltage (max): 1.575/2.7/3.465V
• Operating Supply Voltage (min): 1.235/2.3/3.135V
• Mounting: Surface Mount
• Operating Temperature (max): 70C
• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Not Compliant

IXP28XX Network Processor
MSF (SPI-4/CSIX/FC)
5.4
Table 38.
108
FC_RXCSRB_L
FC_RXCSRB
SPI4_RDAT[0]
SPI4_RDAT_L[0]
FC_RXCSOF_L
FC_RXCSOF
SPI4_RDAT[4]
SPI4_RDAT_L[4]
FC_RXCDAT[0]
FC_RXCDAT_L[0]
SPI4_RDAT[5]
SPI4_RDAT_L[5]
FC_RXCCLK_L
FC_RXCCLK
SPI4_TDAT_L[11]
SPI4_TDAT[11]
SPI4_TDAT_L[3]
SPI4_TDAT[3]
FC_RXCFC_L
FC_RXCFC
FC_RXCDAT_L[1]
FC_RXCDAT[1]
Signal
Note: If the flight delay of the target PCB is not 180 ps/in then the ratio, (154/180), must be modified
Package Trace Lengths for LVDS_Diff Signals
Table 38
designs that implement dynamic deskew via training, matching of trace lengths through the
package is not required as the deskew logic will correct this mismatch. For designs that implement
static deskew, trace length-matching through the package may be required.
The flight time on the package substrate is 154ps/in which differs from the flight delay of standard
FR4, typical 180ps/in. As a result the package routing lengths in
compensate for the difference in flight delay between the package and the PCB. For example
FC_RXCSRB_L has a package length of 0.597 in, and the target PCB has a flight delay of
180ps/in. In order to adjust the package length to match the PCB flight delay this length must be
multiplied by the ratio of 154/180 or the difference between the package and PCB flight delays.
Therefore the trace package routing length that must be accounted for on the PCB is
0.597*(154/180) or 0.511 in.
accordingly, i.e., the denominator would be changed to reflect the actual flight delay.
Package Trace Lengths for LVDS_Diff Signals (Sheet 1 of 2)
15.168
15.167
14.548
14.546
14.46
14.455
14.249
14.246
14.115
14.114
13.928
13.928
13.368
13.365
12.978
12.976
12.947
12.945
12.888
12.883
12.577
12.573
Metric
Units
(mm)
provides package trace lengths for LVDS_Diff signals, listed by decreasing lengths. For
English
0.597
0.597
0.573
0.573
0.569
0.569
0.561
0.561
0.556
0.556
0.548
0.548
0.526
0.526
0.511
0.511
0.510
0.510
0.507
0.507
0.495
0.495
Units
(in)
SPI4_TDAT[15]
SPI4_RDAT[2]
SPI4_RDAT_L[2]
SPI4_RDAT_L[10]
SPI4_RDAT[10]
FC_RXCDAT_L[2]
FC_RXCDAT[2]
FC_TXCFC
FC_TXCFC_L
SPI4_TPAR
SPI4_TPAR_L
FC_RXCPAR_L
FC_RXCPAR
SPI4_TCLK_L
SPI4_TCLK
SPI4_TCTL_L
SPI4_TCTL
SPI4_TDAT_L[8]
SPI4_TDAT[8]
SPI4_RDAT[14]
SPI4_RDAT_L[14]
SPI4_TDAT_L[10]
Signal
11.51
11.313
11.312
11.166
11.164
11.135
11.133
11.018
11.013
10.961
10.953
10.769
10.768
10.745
10.744
10.595
10.591
10.226
10.222
9.97
9.968
9.952
Metric
Units
(mm)
English
0.453
0.445
0.445
0.440
0.440
0.438
0.438
0.434
0.434
0.432
0.431
0.424
0.424
0.423
0.423
0.417
0.417
0.403
0.402
0.393
0.392
0.392
Units
(in)
SPI4_TDAT[2]
SPI4_TDAT_L[2]
FC_RXCDAT_L[3]
FC_RXCDAT[3]
SPI4_TDAT[14]
SPI4_RCLK
SPI4_RCLK_L
SPI4_TDAT[13]
SPI4_TDAT_L[13]
SPI4_TDAT_L[5]
SPI4_TDAT[5]
SPI4_RCTL
SPI4_RCTL_L
SPI4_RDAT[11]
SPI4_RDAT_L[11]
SPI4_RDAT[8]
SPI4_TDAT_L[14]
FC_TXCCLK_L
FC_TXCCLK
SPI4_RDAT_L[8]
FC_TXCDAT[2]
FC_TXCDAT_L[2]
Table 38
Signal
Hardware Design Guide
must be adjusted to
8.628
8.623
8.424
8.42
7.807
7.807
7.721
7.717
7.684
7.68
7.657
7.654
7.65
7.649
7.489
7.486
7.436
7.435
7.314
7.311
7.195
7.195
Metric
Units
(mm)
English
0.340
0.339
0.332
0.331
0.307
0.307
0.304
0.304
0.303
0.302
0.301
0.301
0.301
0.301
0.295
0.295
0.293
0.293
0.288
0.288
0.283
0.283
Units
(in)