RPIXP2850BB Intel, RPIXP2850BB Datasheet - Page 77

• Manufacturer Part Number: RPIXP2850BB
• Manufacturer: Intel

Specifications of RPIXP2850BB

• Operating Supply Voltage (typ): 1.3/1.5/2.5/3.3V
• Operating Supply Voltage (max): 1.575/2.7/3.465V
• Operating Supply Voltage (min): 1.235/2.3/3.135V
• Mounting: Surface Mount
• Operating Temperature (max): 70C
• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Not Compliant

Table 29.
Figure 39.
Table 30.
Hardware Design Guide
QDR Control RPE# and WPE# Signal Group Routing Guidelines (Sheet 2 of 2)
1.
Figure 39
QDR Control RPE# and WPE# Signal Trace Width/Spacing Routing
Table 30
QDR CONTROL Stack-up Signal Cross-section Details
Figure 40
Group Spacing
Trace length P
Trace length B, C
Trace length D
Maximum via count per signal
Length tuning method
Parameter
Value
P refers to the package length.
T
signal
lists the QDR CONTROL stack-up signal cross-section details.
T
T
illustrates routing for QDR control RPE# and WPE# signal trace width/spacing.
illustrates the routing topology for QDR control BWE# signals.
d2
d1
Parameter
Signal
CONT
QDR
ROL
1
+A to SRAMs
Signals
Other
Width (W)
[mils]
Trace
5
Thickness
(Tsignal)
20 mil or larger
[mils]
Trace
Isolation from all other signals is 20 - 25mils.
Should be matched to K-Clk trace length minus 0.5 inches.
Maximum = 11.0 inches
As short as possible.
Maximum B = 1.0 inches
Maximum C = 1.0 inches
As short as possible; Maximum = 1.0 inch
As small as possible; Maximum = 7 vias
All CONTROL signals matched within ±25 mils, where length includes
package length compensation (P+A)
0.5
Prepreg
POWER or GND Plane
POWER or GND Plane
(S) [mils]
Spacing
Trace
8 - 15
Thickness
CONTROL
Signal
[mils]
(TD1)
D1
5.0
W
Routing Guideline
Thickness
IXP28XX Network Processor
[mils]
(Td2)
5.7
D2
S
Er(D1) Er(D2)
3.5
CONTROL
Signal
W
3.8
QDR SRAM
D2
D1
between
3995-01
Spacing
groups
20 - 25
signal
[mils]
77