RPIXP2850BB Intel, RPIXP2850BB Datasheet - Page 34
RPIXP2850BB
Manufacturer Part Number
RPIXP2850BB
Description
Manufacturer
Intel
Datasheet
1.RPIXP2850BB.pdf
(154 pages)
Specifications of RPIXP2850BB
Operating Supply Voltage (typ)
1.3/1.5/2.5/3.3V
Operating Supply Voltage (max)
1.575/2.7/3.465V
Operating Supply Voltage (min)
1.235/2.3/3.135V
Mounting
Surface Mount
Operating Temperature (max)
70C
Operating Temperature (min)
0C
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant
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IXP28XX Network Processor
RDRAM
3.1.1
Table 12.
34
The multi-tiered NexMod* module contains all of the circuitry for an entire Rambus* channel in a
single module. The NexMod* module can be attached either to the main board with pin grid array
(PGA) connectors or soldered with ball grid array (BGA) technology. The module incorporates
termination resistors, the Direct Rambus* Clock Generator (DRCG), and a Voltage Regulator
Module (VRM) on the same modular subsystem as the memory chips.
In summary, its features are:
The NexMod* modules are also available from Samsung and Viking. The IXMB2800 layout
details are provided in
RDRAM Subsystem Implementation Options
Table 12
RDRAM Subsystem Implementation Options (Sheet 1 of 2)
Short channel with two
devices
Short channel with four
devices
HCD NexMOD*
(eight devices per channel)
SO-RIMM*
(eight devices per channel)
Standard RIMM*
(eight devices per channel)
•
•
•
•
Density up to 256 Mbytes per channel
Built-in termination and clock generation
With its 1.1 in. x 2.0 in. size, NexMod* is very space-efficient (compared to SO-RIMM and
RIMM solutions)
Stacked assembly
describes RDRAM subsystem implementation options.
Option
Section
Using 256-
192 Mbytes
384 Mbytes
768 Mbytes
768 Mbytes
768 Mbytes
Mbyte part
3.5.
Memory per NPU
384 Mbytes
768 Mbytes
Using 512-
Mbyte part
1.5 Gbytes
1.5 Gbytes
1.5 Gbytes
• Clam-shell configuration helps in layout.
• Observability of clam-shell components is
• Must follow all design rules defined in the
• Clam-shell configuration helps in layout.
• Observability of clam-shell components is
• Must follow all design rules defined in the
• HCD module contains VRM and terminators
• HCD also simplifies channel design since
• SO-RIMM* mounting is horizontal.
• Must follow all design rules defined in the
• RIMM* mounting is vertical, but the
• Board placement for a dual-NPU design is
• Vendors: Samsung*, Elpida*
an issue.
Rambus* Short Channel Design Guide.
an issue.
Rambus* Short Channel Design Guide.
on the module, making it very space-
efficient.
many of the Rambus* design rules are
handled on the module.
Rambus* Long Channel Design Guide.
connector is very long.
challenging.
Hardware Design Guide
Comments
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