RPIXP2850BB Intel, RPIXP2850BB Datasheet - Page 69

• Manufacturer Part Number: RPIXP2850BB
• Manufacturer: Intel

Specifications of RPIXP2850BB

• Operating Supply Voltage (typ): 1.3/1.5/2.5/3.3V
• Operating Supply Voltage (max): 1.575/2.7/3.465V
• Operating Supply Voltage (min): 1.235/2.3/3.135V
• Mounting: Surface Mount
• Operating Temperature (max): 70C
• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Not Compliant

Table 21.
Figure 31.
Table 22.
Hardware Design Guide
QDR D Signal Group Routing Guidelines
1.
Figure 31
QDR D Signal Trace Width/Spacing Routing
Table 22
QDR D Stack-up Signal Cross-section Details
Signal Group
Topology
Reference Plane
Characteristic Trace Impedance
RTT
Nominal Trace Width
Nominal Trace Separation
Group Spacing
Trace length P
Trace length B
Trace length C
Trace length D
Maximum via count per signal
Length tuning method
Parameter
Value
P refers to the package length.
T
signal
lists the QDR D stack-up signal cross-section details.
T
T
illustrates the routing for QDR D signal trace width/spacing.
d2
d1
Signal
Parameter
QDR
1
D
+A to SRAMs
Signals
Other
Width (W)
[mils]
Trace
5
Thickness
(Tsignal)
20 mil or larger
[mils]
Trace
0.5
D
Daisy Chain or Matched-T topology
Ground
50 Ω ±10%
50 Ω ±1%
5 mils
8 - 15 mils
Isolation from all other signals is 20 mils.
Should be matched to K-Clk trace length minus 0.5 inches.
Maximum = 11.0 inches
As short as possible.
Maximum = 0.4 inches
Maximum = 0.5 inches
As short as possible; Maximum = 1.0 inch
As small as possible; Maximum = 7 vias
All D signals matched within ±25 mils, where length includes
package length compensation (P+A)
Prepreg
POWER or GND Plane
POWER or GND Plane
(S) [mils]
Spacing
Trace
8 - 15
Thickness
[mils]
(TD1)
Signal
DATA
D1
5.0
W
Routing Guideline
Thickness
IXP28XX Network Processor
[mils]
(Td2)
5.7
D2
S
Er(D1) Er(D2)
3.5
Signal
DATA
W
3.8
QDR SRAM
D2
D1
B3992-01
between
Spacing
groups
20 - 25
signal
[mils]
69