DSPD56367PV150 Freescale Semiconductor, DSPD56367PV150 Datasheet - Page 26

• Manufacturer Part Number: DSPD56367PV150
• Manufacturer: Freescale Semiconductor

Specifications of DSPD56367PV150

• Device Core Size: 24b
• Format: Fixed Point
• Clock Freq (max): 150MHz
• Mips: 150
• Device Input Clock Speed: 150MHz
• Ram Size: 69KB
• Program Memory Size: 120KB
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (min): 1.71/3.14V
• Operating Supply Voltage (max): 1.89/3.46V
• Operating Temp Range: -40C to 95C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Lead Free Status / Rohs Status: Not Compliant

Thermal Characteristics
3.3
3-2
1
2
3
Supply Voltage
All “3.3V tolerant” input voltages
Current drain per pin excluding V
Operating temperature range
Storage temperature
GND = 0 V, VCCP, VCCQL = 1.8 V ±5%, TJ = –40×C to +95×C, CL = 50 pF
All other VCC = 3.3 V ± 5%, TJ = –40×C to +95×C, CL = 50 pF
Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond
the maximum rating may affect device reliability or cause permanent damage to the device.
Temperatures below -0°C are qualified for consumer applications.
1
2
3
4
Natural Convection, Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Natural Convection, Thermal characterization parameter
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
Thermal Characteristics
Rating
Characteristic
3
1
CC
and GND
3
Table 3-2 Thermal Characteristics
DSP56367 Technical Data, Rev. 2.1
Table 3-1 Maximum Ratings
V
V
CCQH,
CCC,
4
V
CCQL,
Symbol
1,2
V
T
V
V
CCH,
T
STG
CCA,
I
IN
J
V
CCP
V
V
R
R
CCS,
CCD,
Symbol
θJC
θJA
Ψ
or θ
or θ
JT
JA
JC
GND
TQFP Value
−
−
−
−
−
0.3 to + 2.0
0.3 to + 4.0
Value
55 to +125
40 to + 95
0.3 to V
45.0
10.0
3.0
10
1, 2
CC
Freescale Semiconductor
+ 0.7
°
°
°
Unit
C/W
C/W
C/W
Unit
mA
°
°
V
V
V
C
C