MC9S08GT60CFD Freescale Semiconductor, MC9S08GT60CFD Datasheet - Page 273

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MC9S08GT60CFD

Manufacturer Part Number
MC9S08GT60CFD
Description
MCU 8BIT 60K FLASH 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08GT60CFD

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-QFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

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A.9
This section describes ac timing characteristics for each peripheral system. For detailed information about
how clocks for the bus are generated, see
A.9.1
Freescale Semiconductor
Bus frequency (t
Real-time interrupt internal oscillator period
External reset pulse width
Reset low drive
Active background debug mode latch setup time
Active background debug mode latch hold time
IRQ pulse width
Port rise and fall time (load = 50 pF)
Slew rate control disabled
Slew rate control enabled
AC Characteristics
Control Timing
–60
2
3
cyc
= 1/f
Figure A-10. Internal Oscillator Deviation from Trimmed Frequency
Bus
–40
Parameter
1
)
–20
4
TEMPERATURE (°C)
–0.1
0.1
MC9S08GB/GT Data Sheet, Rev. 2.3
0
Table A-10. Control Timing
–0.2
–0.3
–0.4
–0.5
–0.6
Chapter 7, “Internal Clock Generator (ICG)
20
t
Symbol
Rise
t
t
t
MSSU
t
rstdrv
t
f
extrst
20
t
MSH
ILIH
Bus
RTI
, t
Fall
60
f
f
1.5 x t
Self_reset
Self_reset
1.5 x
34 x
Min
700
dc
25
25
cyc
80
Note: Device trimmed at 25°C at 2 V
Typical
2 V
3 V
30
3
100
Module.”
1300
Max
AC Characteristics
120
20
MHz
Unit
µs
ns
ns
ns
ns
ns
ns
273

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