MC9S08GT60CFD Freescale Semiconductor, MC9S08GT60CFD Datasheet - Page 285

• Manufacturer Part Number: MC9S08GT60CFD
• Description: MCU 8BIT 60K FLASH 48-QFN
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08GT60CFD

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 39
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-QFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

B.6
Freescale Semiconductor
SEATING
PLANE
-T-
42-Pin SDIP Package Drawing
42
1
D
F
0.25 (0.010)
42 PL
-A-
M
T
G
A
S
MC9S08GB/GT Data Sheet, Rev. 2.3
22
21
N
C
K
-B-
CASE 858-01
J
ISSUE O
42 PL
0.25 (0.010)
M
H
T
L
B
M
S
NOTES:
1.
2.
3.
4.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION L TO CENTER OF LEAD WHEN FORMED
PARALLEL.
DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
MAXIMUM MOLD FLASH 0.25 (0.010).
DIM
G
M
A
B
C
D
F
H
J
K
L
N
1.435
0.540
0.155
0.014
0.032
0.008
0.115
0.020
MIN
0.070 BSC
0.300 BSC
0.600 BSC
0
42-Pin SDIP Package Drawing
INCHES
1.465
0.560
0.200
0.022
0.046
0.015
0.135
0.040
MAX
15
36.45
13.72
MILLIMETERS
MIN
3.94
0.36
0.81
0.20
2.92
0.51
DATE 02/27/90
1.778 BSC
15.24 BSC
7.62 BSC
0
37.21
14.22
MAX
5.08
0.56
1.17
0.38
3.43
1.02
15
285