DF2398TE20 Renesas Electronics America, DF2398TE20 Datasheet - Page 179

• Manufacturer Part Number: DF2398TE20
• Description: IC H8S MCU FLASH 256K 120TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2398TE20

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 87
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 120-TQFP, 120-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2398TE20; HD64F2398TE20

6.6
When burst mode is selected with the DRAM interface, the DACK output timing can be selected with the DDS bit. When
DRAM space is accessed in DMAC single address mode at the same time, whether or not burst access is to be performed
is selected.
6.6.1
Burst access is performed by determining the address only, irrespective of the bus master. The DACK output goes low
from the T
Figure 6-28 shows the DACK output timing for the DRAM interface when DDS = 1.
DMAC Single Address Mode and DRAM Interface
When DDS = 1
C1
state in the case of the DRAM interface.
CSn, (RAS)
CAS, LCAS
HWR, (WE)
Figure 6-27 Self-Refresh Timing (When CW2 = 1, or CW2 = 0 and LCASS = 0)
Note: n = 2 to 5
Figure 6-28 DACK Output Timing when DDS = 1 (Example of DRAM Access)
Read
Write
ø
LCAS, (LCAS)
CAS, (UCAS),
HWR, (WE)
HWR, (WE)
CSn, (RAS)
T
Rp
D
D
Note: n = 2 to 5
A
15
15
23
DACK
to D
to D
to A
ø
0
0
0
T
Rcr
T
p
High
Row
T
r
T
Software
c1
standby
Column
Rev.6.00 Oct.28.2004 page 149 of 1016
T
c2
T
Rc3
REJ09B0138-0600H