DF2398TE20 Renesas Electronics America, DF2398TE20 Datasheet - Page 27

• Manufacturer Part Number: DF2398TE20
• Description: IC H8S MCU FLASH 256K 120TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2398TE20

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 87
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 120-TQFP, 120-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2398TE20; HD64F2398TE20

19.23 Flash Memory Programming and Erasing Precautions ............................................................................................658
Section 20 Clock Pulse Generator ....................................................................................................661
20.1 Overview................................................................................................................................................................... 661
20.2 Register Descriptions................................................................................................................................................662
20.3 Oscillator................................................................................................................................................................... 663
20.4 Duty Adjustment Circuit........................................................................................................................................... 665
20.5 Medium-Speed Clock Divider..................................................................................................................................665
20.6 Bus Master Clock Selection Circuit ......................................................................................................................... 665
Section 21 Power-Down Modes .......................................................................................................667
21.1 Overview................................................................................................................................................................... 667
21.2 Register Descriptions................................................................................................................................................669
21.3 Medium-Speed Mode ............................................................................................................................................... 672
21.4 Sleep Mode............................................................................................................................................................... 672
21.5 Module Stop Mode ................................................................................................................................................... 673
21.6 Software Standby Mode ........................................................................................................................................... 675
21.7 Hardware Standby Mode ..........................................................................................................................................678
21.8 ø Clock Output Disabling Function..........................................................................................................................679
Section 22 Electrical Characteristics.................................................................................................681
22.1 Electrical Characteristics of Masked ROM Version (H8S/2398) and
19.22.2 Socket Adapters and Memory Map............................................................................................................. 648
19.22.3 Programmer Mode Operation......................................................................................................................650
19.22.4 Memory Read Mode....................................................................................................................................651
19.22.5 Auto-Program Mode ................................................................................................................................... 653
19.22.6 Auto-Erase Mode......................................................................................................................................... 655
19.22.7 Status Read Mode........................................................................................................................................656
19.22.8 Status Polling............................................................................................................................................... 657
19.22.9 Programmer Mode Transition Time............................................................................................................657
19.22.10 Notes on Memory Programming ............................................................................................................... 658
20.1.1 Block Diagram............................................................................................................................................. 661
20.1.2 Register Configuration ................................................................................................................................661
20.2.1 System Clock Control Register (SCKCR) ..................................................................................................662
20.3.1 Connecting a Crystal Resonator ..................................................................................................................663
20.3.2 External Clock Input ................................................................................................................................... 664
21.1.1 Register Configuration ................................................................................................................................668
21.2.1 Standby Control Register (SBYCR) ........................................................................................................... 669
21.2.2 System Clock Control Register (SCKCR) ..................................................................................................670
21.2.3 Module Stop Control Register (MSTPCR) ................................................................................................. 671
21.5.1 Module Stop Mode ......................................................................................................................................673
21.5.2 Usage Notes................................................................................................................................................. 674
21.6.1 Software Standby Mode ..............................................................................................................................675
21.6.2 Clearing Software Standby Mode ............................................................................................................... 675
21.6.3 Setting Oscillation Stabilization Time after Clearing Software Standby Mode ......................................... 675
21.6.4 Software Standby Mode Application Example ........................................................................................... 676
21.6.5 Usage Notes................................................................................................................................................. 677
21.7.1 Hardware Standby Mode............................................................................................................................. 678
21.7.2 Hardware Standby Mode Timing ................................................................................................................678
ROMless Versions (H8S/2394, H8S/2392, and H8S/2390)..................................................................................... 681
22.1.1 Absolute Maximum Ratings........................................................................................................................681
22.1.2 DC Characteristics....................................................................................................................................... 682
Rev.6.00 Oct.28.2004 page xxi of xxiv
REJ09B0138-0600H