ADSP-21161NKCAZ100 Analog Devices Inc, ADSP-21161NKCAZ100 Datasheet - Page 2

• Manufacturer Part Number: ADSP-21161NKCAZ100
• Description: IC,DSP,32-BIT,CMOS,BGA,225PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Fixed/Floating Pointr

Specifications of ADSP-21161NKCAZ100

• Rohs Compliant: YES
• Interface: Host Interface, Link Port, Serial Port
• Clock Rate: 100MHz
• Non-volatile Memory: External
• On-chip Ram: 128kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.80V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 225-MBGA, 225-Mini-BGA
• Device Core Size: 32b
• Architecture: Enhanced Harvard
• Format: Floating Point
• Clock Freq (max): 100MHz
• Mips: 100
• Device Input Clock Speed: 100MHz
• Ram Size: 128KB
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (min): 1.71/3.13V
• Operating Supply Voltage (max): 1.89/3.47V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 225
• Package Type: CSPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ADSP21161NKCAZ100

ADSP-21161N
TABLE OF CONTENTS
Summary ............................................................... 1
Revision History ...................................................... 2
General Description ................................................. 3
Pin Function Descriptions ....................................... 12
Specifications ........................................................ 18
REVISION HISTORY
11/09—Rev. A to Rev. B.
Corrected all outstanding document errata.
Added 110 MHz products. See the following sections.
Benchmarks ........................................................... 3
Operating Conditions ............................................. 18
Electrical Characteristics .......................................... 19
Timing Specifications ............................................. 20
Ordering Guide ..................................................... 59
This revision contains a change in package nomenclature from
MiniBGA (or MBGA) to chip-scale package, ball grid array (or
CSP_BGA). This change in no way affects or changes fit, form,
or function of the actual product. See
ADSP-21161N Family Core Architecture .................... 3
ADSP-21161N Memory and I/O Interface Features ....... 5
Development Tools ............................................... 9
Additional Information ........................................ 11
Boot Modes ....................................................... 17
Operating Conditions .......................................... 18
Electrical Characteristics ....................................... 19
Ordering Guide .... 59
Rev. B | Page 2 of 60 | November 2009
225-Ball CSP_BGA Ball Configurations ....................... 57
Outline Dimensions ................................................ 59
Ordering Guide ..................................................... 59
Package Information ............................................ 20
Absolute Maximum Ratings ................................... 20
ESD Caution ...................................................... 20
Timing Specifications ........................................... 20
Power Dissipation ............................................... 21
Output Drive Currents ......................................... 55
Test Conditions .................................................. 55
Environmental Conditions .................................... 56
Surface-Mount Design .......................................... 59