ADSP-21161NKCAZ100 Analog Devices Inc, ADSP-21161NKCAZ100 Datasheet - Page 59

• Manufacturer Part Number: ADSP-21161NKCAZ100
• Description: IC,DSP,32-BIT,CMOS,BGA,225PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Fixed/Floating Pointr

Specifications of ADSP-21161NKCAZ100

• Rohs Compliant: YES
• Interface: Host Interface, Link Port, Serial Port
• Clock Rate: 100MHz
• Non-volatile Memory: External
• On-chip Ram: 128kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.80V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 225-MBGA, 225-Mini-BGA
• Device Core Size: 32b
• Architecture: Enhanced Harvard
• Format: Floating Point
• Clock Freq (max): 100MHz
• Mips: 100
• Device Input Clock Speed: 100MHz
• Ram Size: 128KB
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (min): 1.71/3.13V
• Operating Supply Voltage (max): 1.89/3.47V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 225
• Package Type: CSPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ADSP21161NKCAZ100

OUTLINE DIMENSIONS
The ADSP-21161N comes in a 17 mm 17 mm, 225-ball
CSP_BGA package with 15 rows of balls.
SURFACE-MOUNT DESIGN
Table 41
dard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Table 41. BGA Data for Use with Surface-Mount Design
ORDERING GUIDE
1
2
Package
225-Ball CSP_BGA (BC-225-1)
Model
ADSP-21161NKCA-100
ADSP-21161NCCA-100
ADSP-21161NKCAZ100
ADSP-21161NCCAZ100
ADSP-21161NYCAZ110
Referenced temperature is case temperature.
Z indicates RoHS compliant package.
is provided as an aid to PCB design. For industry stan-
CORNER
A1 BALL
2
2
2
* 1.85
1.71
1.40
Temperature Range
0 C to 85 C
–40 C to +105 C
0 C to 85 C
–40 C to +105 C
–40 C to +125 C
DETAIL A
* COMPLIANT TO JEDEC STANDARDS MO-192-AAF-2
Ball Attach Type
Solder Mask Defined
WITH THE EXCEPTION TO PACKAGE HEIGHT AND THICKNESS.
TOP VIEW
17.20
17.00 SQ
16.80
Figure 46. 225-Ball CSP_BGA (BC-225-1)
Rev. B | Page 59 of 60 | November 2009
1
BSC SQ
14.00
SEATING
PLANE
0.50
REF
0.54
0.50
0.30
BSC
Instruction Rate
100 MHz
100 MHz
100 MHz
100 MHz
110 MHz
1.00
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
Solder Mask Opening
0.40 mm diameter
BOTTOM VIEW
DETAIL A
BALL DIAMETER
0.70
0.60
0.50
On-Chip
SRAM
1M bit
1M bit
1M bit
1M bit
1M bit
* 1.31
1.21
1.10
C
E
G
J
L
N
R
A
B
D
F
H
K
M
P
COPLANARITY
0.20
A1 BALL
CORNER
Package
Description
225-Ball CSP_BGA BC-225-1
225-Ball CSP_BGA BC-225-1
225-Ball CSP_BGA BC-225-1
225-Ball CSP_BGA BC-225-1
225-Ball CSP_BGA BC-225-1
Ball Pad Size
0.53 mm diameter
ADSP-21161N
Package
Option