DSPIC33FJ128MC706-I/PT Microchip Technology Inc., DSPIC33FJ128MC706-I/PT Datasheet - Page 358

• Manufacturer Part Number: DSPIC33FJ128MC706-I/PT
• Description: 16 BIT MCU/DSP 64LD 40MIPS 128KB FLASH
• Manufacturer: Microchip Technology Inc.
• Type: DSPr

Specifications of DSPIC33FJ128MC706-I/PT

• A/d Inputs: 16-Channels, 12-Bit
• Comparators: 8
• Cpu Speed: 40 MIPS
• Eeprom Memory: 0 Bytes
• Input Output: 53
• Interface: CAN/I2C/SPI/UART
• Ios: 53
• Memory Type: Flash
• Number Of Bits: 16
• Package Type: 64-pin TQFP
• Programmable Memory: 128K Bytes
• Ram Size: 16K Bytes
• Timers: 9-16-bit, 4-32-bit
• Voltage, Range: 3-3.6
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

100-Lead Plastic Thin-Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
© 2006 Microchip Technology Inc.
c
B
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-110
p
See ASME Y14.5M
See ASME Y14.5M
Dimension Limits
#leads=n1
E1
E
Units
A2
D1
n1
E1
A1
D
B
n
p
A
L
F
E
c
n
MIN
.037
.002
.018
.004
.007
Preliminary
11°
11°
2
1
0°
D1
.020 BSC
.630 BSC
.630 BSC
.551 BSC
.551 BSC
.039 REF
L
INCHES
D
NOM
A1
.039
.024
.009
100
3.5°
12°
12°
25
A
MAX
.047
.006
.030
.008
.041
.011
13°
13°
F
7°
MIN
0.95
0.05
0.45
0.09
0.17
11°
11°
0°
MILLIMETERS*
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
0.50 BSC
1.00 REF
NOM
dsPIC33F
1.00
0.60
0.22
Revised 07-21-05
100
3.5°
12°
12°
25
DS70165D-page 355
MAX
1.20
1.05
0.15
0.75
0.20
0.27
A2
13°
13°
7°