MC68HC711E9FU Freescale Semiconductor, MC68HC711E9FU Datasheet - Page 183

• Manufacturer Part Number: MC68HC711E9FU
• Manufacturer: Freescale Semiconductor

Specifications of MC68HC711E9FU

• Cpu Family: HC11
• Device Core Size: 8b
• Frequency (max): 4MHz
• Interface Type: SCI/SPI
• Program Memory Type: EPROM
• Program Memory Size: 12KB
• Total Internal Ram Size: 512Byte
• # I/os (max): 38
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 8-chx8-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 64
• Package Type: PQFP
• Lead Free Status / Rohs Status: Not Compliant

11.6 52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
Freescale Semiconductor
C
J
G
0.51 (0.020)
-A-
R
S
F
M
T
A
S
B
N
M68HC11E Family Data Sheet, Rev. 5.1
D
K
S
H
52 PL
0.18 (0.007)
-B-
0.51 (0.020)
-T-
0.15 (0.006)
SEATING
PLANE
M
M
T
T
A
52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
A
S
S
B
B
S
S
NOTES:
1.
2.
3.
4.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION R AND N DO NOT INCLUDE
GLASS PROTRUSION. GLASS PROTRUSION
TO BE 0.25 (0.010) MAXIMUM.
ALL DIMENSIONS AND TOLERANCES
INCLUDE LEAD TRIM OFFSET AND LEAD
DIM
A
B
C
D
G
H
K
N
R
S
F
J
0.785
0.785
0.165
0.017
0.026
0.090
0.006
0.035
0.735
0.735
0.690
MIN
0.050 BSC
INCHES
0.795
0.795
0.200
0.021
0.032
0.130
0.010
0.045
0.756
0.756
0.730
MAX
19.94
19.94
18.67
18.67
17.53
MILLIMETERS
MIN
4.20
0.44
0.67
2.29
0.16
0.89
1.27 BSC
MAX
20.19
20.19
19.20
19.20
18.54
5.08
0.53
0.81
3.30
0.25
1.14
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