DSPIC30F2023 Microchip Technology Inc., DSPIC30F2023 Datasheet - Page 270

no-image

DSPIC30F2023

Manufacturer Part Number
DSPIC30F2023
Description
28/44-pin Dspic30f1010/202x Enhanced Flash Smps 16-bit Digital Signal Controller
Manufacturer
Microchip Technology Inc.
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F2023-20E/ML
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F2023-20E/PT
Manufacturer:
Microchip Technology
Quantity:
135
Part Number:
DSPIC30F2023-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F2023-20E/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F2023-30I/ML
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F2023-30I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F2023-30I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F2023-30I/PTD32
Manufacturer:
Microchip Technology
Quantity:
135
Part Number:
DSPIC30F2023-30I/PTD32
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F2023T-20E/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F2023T-30I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
dsPIC30F1010/202X
28-Lead Plastic Quad Flat, No Lead Package (MM) - 6x6x0.9 mm Body (QFN-S)
With 0.40 mm Contact Length
DS70178C-page 268
Note:
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
TOP VIEW
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
D
N
Dimension Limits
A1
2
1
Preliminary
EXPOSED
E
A
Microchip Technology Drawing No. C04–124, Sept. 8, 2006
NOTE 1
Units
PAD
A1
A3
E2
D2
E2
N
A
E
D
K
e
b
L
2
1
MIN
0.80
0.00
3.65
3.65
0.23
0.30
0.20
N
MILLIMETERS
BOTTOM VIEW
0.65 BSC
0.20 REF
6.00 BSC
6.00 BSC
NOM
0.90
0.02
3.70
3.70
0.38
0.40
28
D2
MAX
1.00
0.05
4.70
4.70
0.43
0.50
© 2006 Microchip Technology Inc.
L
b
e
K

Related parts for DSPIC30F2023