MC908AP64CFAE Freescale Semiconductor, MC908AP64CFAE Datasheet - Page 310

• Manufacturer Part Number: MC908AP64CFAE
• Description: IC MCU 64K 8MHZ SPI 48-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HC08r

Specifications of MC908AP64CFAE

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I²C, IRSCI, SCI, SPI
• Peripherals: LED, LVD, POR, PWM
• Number Of I /o: 32
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Cpu Family: HC08
• Device Core Size: 8b
• Frequency (max): 8MHz
• Interface Type: SCI/SPI
• Total Internal Ram Size: 2KB
• # I/os (max): 32
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: LQFP
• Controller Family/series: HC08
• No. Of I/o's: 32
• Ram Memory Size: 2KB
• Cpu Speed: 8MHz
• No. Of Timers: 2
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• Processor Series: HC08AP
• Core: HC08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: FSICEBASE, DEMO908AP64E, M68CBL05CE
• Minimum Operating Temperature: - 40 C
• Package: 48LQFP
• Family Name: HC08
• Maximum Speed: 8 MHz
• Operating Supply Voltage: 3.3|5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Electrical Specifications
308
Operating frequency
Bus free time
Repeated start hold time.
Repeated start setup time.
Stop setup time
Hold time
Setup time
Clock low time-out
Clock low
Clock high
Slave clock low extend time
Master clock low extend time
Fall time
Rise time
1. Devices participating in a transfer will timeout when any clock low exceeds the value of T
2. T
3. T
4. T
5. Rise and fall time is defined as follows: T
that have detected a timeout condition must reset the communication no later than T
value specified must be adhered to by both a master and a slave as it incorporates the cumulative limit for both a master
(10 ms) and a slave (25 ms).
Software should turn-off the MMIIC module to release the SDA and SCL lines.
to the stop. If a slave device exceeds this time, it is expected to release both its clock and data lines and reset itself.
defined from start-to-ack, ack-to-ack, or ack-to-stop.
HIGH MAX
LOW.SEXT
LOW.MEXT
Characteristic
provides a simple guaranteed method for devices to detect the idle conditions.
is the cumulative time a slave device is allowed to extend the clock cycles in one message from the initial start
is the cumulative time a master device is allowed to extend its clock cycles within each byte of a message as
Table 22-13. MMIIC Interface Input/Output Signal Timing
t
t
LOW.MEXT
LOW.SEXT
Symbol
t
t
t
t
t
t
TIMEOUT
SU.STO
HD.STA
HD.DAT
SU.DAT
SU.STA
t
f
t
t
HIGH
SMB
LOW
BUF
MC68HC908AP Family Data Sheet, Rev. 4
t
t
R
F
R
= (V
ILMAX
Min
300
250
4.7
4.7
4.0
4.7
4.0
10
4.0
25
—
—
—
—
– 0.15) to (V
Typ
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1000
IHMIN
Max
100
300
35
—
—
—
—
—
—
—
—
25
10
+ 0.15), T
Unit
kHz
ms
ms
ms
µs
µs
µs
µs
ns
ns
µs
µs
ns
ns
F
MMIIC operating frequency
Bus free time between STOP and
START condition
Hold time after (repeated) START
condition. After this period, the first
clock is generated.
Repeated START condition setup time.
Stop condition setup time.
Data hold time.
Data setup time.
Clock low time-out.
Clock low period
Clock high period.
Cumulative clock low extend time (slave
device)
Cumulative clock low extend time
(master device)
Clock/Data Fall Time
Clock/Data Rise Time
= 0.9×V
TIMEOUT
(3)
TIMEOUT
DD
max of 35ms. The maximum
to (V
Comments
Freescale Semiconductor
(4)
min. of 25ms. Devices
ILMAX
(2)
(1)
(5)
(5)
– 0.15).