MC908AP64CFAE Freescale Semiconductor, MC908AP64CFAE Datasheet - Page 316

• Manufacturer Part Number: MC908AP64CFAE
• Description: IC MCU 64K 8MHZ SPI 48-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HC08r

Specifications of MC908AP64CFAE

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I²C, IRSCI, SCI, SPI
• Peripherals: LED, LVD, POR, PWM
• Number Of I /o: 32
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Cpu Family: HC08
• Device Core Size: 8b
• Frequency (max): 8MHz
• Interface Type: SCI/SPI
• Total Internal Ram Size: 2KB
• # I/os (max): 32
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: LQFP
• Controller Family/series: HC08
• No. Of I/o's: 32
• Ram Memory Size: 2KB
• Cpu Speed: 8MHz
• No. Of Timers: 2
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• Processor Series: HC08AP
• Core: HC08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: FSICEBASE, DEMO908AP64E, M68CBL05CE
• Minimum Operating Temperature: - 40 C
• Package: 48LQFP
• Family Name: HC08
• Maximum Speed: 8 MHz
• Operating Supply Voltage: 3.3|5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Electrical Specifications
22.17 Memory Characteristics
314
Data retention voltage
Number of rows per page
Number of bytes per page
Read bus clock frequency
Page erase time
Mass erase time
PGM/ERASE to HVEN setup time
High-voltage hold time
High-voltage hold time (mass erase)
Program hold time
Program time
Address/data setup time
Address/data hold time
Recovery time
Cumulative HV period
Row erase endurance
Row program endurance
Data retention time
1. f
2. If the page erase time is longer than t
3. If the mass erase time is longer than t
4. It is defined as the time it needs before the FLASH can be read after turning off the high voltage charge pump, by clearing
5. t
6. The minimum row endurance value specifies each row of the FLASH memory is guaranteed to work for at least this many
7. The minimum row endurance value specifies each row of the FLASH memory is guaranteed to work for at least this many
8. The FLASH is guaranteed to retain data over the entire operating temperature range for at least the minimum time
memory.
memory.
HVEN to logic 0.
programmed twice before next erase.
erase/program cycles.
erase/program cycle.
specified.
read
hv
is the cumulative high voltage programming time to the same row before next erase, and the same address can not be
is defined as the frequency range for which the FLASH memory can be read.
(8)
(6)
Characteristic
(7)
Table 22-17. Memory Characteristics
MC68HC908AP Family Data Sheet, Rev. 4
erase
me
(Min.), there is no erase-disturb, but it reduces the endurance of the FLASH
(Min.), there is no erase-disturb, but it reduces the endurance of the FLASH
Symbol
t
f
erase
V
read
t
t
t
t
t
me
rcv
t
t
t
t
t
hv
nvh1
prog
RDR
nvh
pgs
ads
adh
—
—
—
nvs
(5)
(3)
(4)
(1)
(2)
Min.
200
100
10k
10k
32k
1.3
20
10
20
20
—
—
10
5
5
1
512
8
Freescale Semiconductor
Max.
8M
40
30
—
—
—
—
—
—
—
—
—
—
—
—
8
Cycles
Cycles
Bytes
Rows
Years
Unit
ms
ms
ms
Hz
µs
µs
µs
µs
µs
µs
V
ns
ns