MC908AP64CFAE Freescale Semiconductor, MC908AP64CFAE Datasheet - Page 318

• Manufacturer Part Number: MC908AP64CFAE
• Description: IC MCU 64K 8MHZ SPI 48-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HC08r

Specifications of MC908AP64CFAE

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I²C, IRSCI, SCI, SPI
• Peripherals: LED, LVD, POR, PWM
• Number Of I /o: 32
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Cpu Family: HC08
• Device Core Size: 8b
• Frequency (max): 8MHz
• Interface Type: SCI/SPI
• Total Internal Ram Size: 2KB
• # I/os (max): 32
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: LQFP
• Controller Family/series: HC08
• No. Of I/o's: 32
• Ram Memory Size: 2KB
• Cpu Speed: 8MHz
• No. Of Timers: 2
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• Processor Series: HC08AP
• Core: HC08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: FSICEBASE, DEMO908AP64E, M68CBL05CE
• Minimum Operating Temperature: - 40 C
• Package: 48LQFP
• Family Name: HC08
• Maximum Speed: 8 MHz
• Operating Supply Voltage: 3.3|5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Mechanical Specifications
23.2 48-Pin Low-Profile Quad Flat Pack (LQFP)
316
B
B1
9
AB
AC
T
12
1
4X
SECTION AE–AE
0.080
4X
0.200 AC T–U
48
13
S1
0.200 AB T–U
BASE METAL
M
A1
F
D
AC
G
A
S
T–U
N
Z
Z
Z
Z
J
37
24
AD
Figure 23-1. 48-Pin LQFP (Case #932)
MC68HC908AP Family Data Sheet, Rev. 4
36
25
U
V1
0.080 AC
DETAIL Y
V
C
H
E
DETAIL AD
TOP & BOTTOM
DETAIL Y
M °
AE
W
P
T, U, Z
AE
AA
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT BOTTOM OF
4. DATUMS T, U, AND Z TO BE DETERMINED AT
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
R
Y14.5M, 1994.
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
DATUM PLANE AB.
SEATING PLANE AC.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE AB.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350.
0.0076.
DIM
AA
A1
B1
S1
V1
W
A
B
C
D
E
G
H
K
M
N
P
R
S
V
F
J
L
MILLIMETERS
1.400
0.170
1.350
0.170
0.050
0.090
0.500
0.090
0.150
L °
MIN
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.500 BSC
0.250 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
1°
12° REF
Freescale Semiconductor
1.600
0.270
1.450
0.230
0.150
0.200
0.700
0.160
0.250
MAX
5°