ATXMEGA256A3B-MH Atmel, ATXMEGA256A3B-MH Datasheet - Page 33

MCU AVR 256KB FLASH A3B 64-QFN

ATXMEGA256A3B-MH

Manufacturer Part Number
ATXMEGA256A3B-MH
Description
MCU AVR 256KB FLASH A3B 64-QFN
Manufacturer
Atmel
Series
AVR® XMEGAr
Datasheets

Specifications of ATXMEGA256A3B-MH

Core Processor
AVR
Core Size
8/16-Bit
Speed
32MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
49
Program Memory Size
256KB (128K x 16)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.6 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-MLF®, 64-QFN
Processor Series
ATXMEGA256x
Core
AVR8
Data Bus Width
8 bit, 16 bit
Data Ram Size
16 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
49
Number Of Timers
7
Operating Supply Voltage
1.6 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATAVRDRAGON, ATAVRISP2, ATAVRONEKIT
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
On-chip Dac
12 bit, 2 Channel
For Use With
ATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMRATSTK600 - DEV KIT FOR AVR/AVR32770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAG770-1004 - ISP 4PORT FOR ATMEL AVR MCU SPI
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
ATXMEGA256A3B-MU
ATXMEGA256A3B-MU

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATXMEGA256A3B-MH
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
4.16.6
8077H–AVR–12/09
LOCKBITS - Non-Volatile Memory Lock Bit Register
• Bit 5:4 - BODACT[1:0]: BOD operation in active mode
The BODACT fuse bits set the BOD operation mode when the device is in active and idle mode
of operation. For details on the BOD and BOD operation modes refer to
Out Detection” on page
Table 4-6.
• Bit 3 - EESAVE: EEPROM memory is preserved through the Chip Erase
A chip erase command will normally erase the Flash, EEPROM and internal SRAM. If the
EESAVE fuse is programmed, the EEPROM is not erased during chip erase. In case EEPROM
is used to store data independent of software revision, the EEPROM can be preserved through
chip erase.
Table 4-7.
Changing of the EESAVE fuse bit takes effect immediately after the write time-out elapses.
Hence, it is possible to update EESAVE and perform a chip erase according to the new setting
of EESAVE without leaving and re-entering programming mode
• Bit 2:0 - BODLEVEL[2:0] - Brown out detection voltage level
The BODLEVEL fuse bits sets the nominal BOD level value. During power-on the device is kept
in reset until the V
that the BOD level is set lower than the V
normal operation, refer to
nominal values, see
• Bit 7:6 - BLBB[1:0]: Boot Lock Bit Boot Loader Section
These bits indicate the locking mode for the Boot Loader Section. Even though the BLBB bits
are writable, they can only be written to a stricter locking. Resetting the BLBB bits is only possi-
ble by executing a Chip Erase Command.
Bit
+0x07
Read/Write
Initial Value
BODACT[1:0]
EESAVE
00
01
10
11
0
1
BOD operation modes in Active and Idle mode
EEPROM memory through Chip Erase
R/W
7
1
Description
Reserved
BOD enabled in sampled mode
BOD enabled continuously
BOD Disabled
Description
EEPROM is preserved during chip erase
EEPROM is not preserved during chip erase
CC
BLBB[1:0]
Table 9-2 on page
level has reached the programmed BOD level. Due to this always ensure
106.
R/W
6
1
Section 9.4 ”Reset Sources” on page 104
R/W
5
1
BLBA[1:0]
106.
CC
R/W
level, also if the BOD is not enabled and used during
4
1
R/W
3
1
BLBAT[1:0]
R/W
2
1
R/W
for details. For BOD level
1
1
LB[1:0]
Section 9.4.2 ”Brown-
XMEGA A
R/W
0
1
LOCKBITS
33

Related parts for ATXMEGA256A3B-MH