ATXMEGA256A3B-MH Atmel, ATXMEGA256A3B-MH Datasheet - Page 339

• Manufacturer Part Number: ATXMEGA256A3B-MH
• Description: MCU AVR 256KB FLASH A3B 64-QFN
• Manufacturer: Atmel
• Series: AVR® XMEGAr

Specifications of ATXMEGA256A3B-MH

• Core Processor: AVR
• Core Size: 8/16-Bit
• Speed: 32MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 49
• Program Memory Size: 256KB (128K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.6 V ~ 3.6 V
• Data Converters: A/D 16x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-MLF®, 64-QFN
• Processor Series: ATXMEGA256x
• Core: AVR8
• Data Bus Width: 8 bit, 16 bit
• Data Ram Size: 16 KB
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 49
• Number Of Timers: 7
• Operating Supply Voltage: 1.6 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR, EWAVR-BL
• Development Tools By Supplier: ATAVRDRAGON, ATAVRISP2, ATAVRONEKIT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 8 Channel
• On-chip Dac: 12 bit, 2 Channel
• For Use With: ATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMRATSTK600 - DEV KIT FOR AVR/AVR32770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAG770-1004 - ISP 4PORT FOR ATMEL AVR MCU SPI
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ATXMEGA256A3B-MU; ATXMEGA256A3B-MU

28.4
28.4.1
8077H–AVR–12/09
JTAG instructions
EXTEST; 0x1
The TAP controller is a 16-state finite state machine that controls the operation of the Boundary-
scan circuitry. The state transitions depicted in
TMS (shown adjacent to each state transition) at a time of the rising edge at TCK. The initial
state after a Power-on Reset is Test-Logic-Reset.
Assuming Run-Test/Idle is the present state, a typical scenario for using the JTAG interface is:
As shown in the state diagram, the Run-Test/Idle state need not be entered between selecting
JTAG instruction and using Data Registers.
Note: Independent of the initial state of the TAP Controller, the Test-Logic-Reset state can
always be entered by holding TMS high for five TCK clock periods.
The Instruction Register is 4-bit wides. Listed below are the JTAG instructions for Boundary-
scan operation and the PDICOM instruction used for accessing the PDI in JTAG mode.
The LSB is shifted in and out first for all Shift Registers.
The OPCODE for each instruction is shown behind the instruction name in hex format. The text
describes which Data Register is selected as path between TDI and TDO for each instruction.
EXTEST is mandatary and the instruction for selecting the Boundary-scan Chain as Data Regis-
ter for testing circuitry external to the AVR package. For the I/O port pins, both output control
(DIR) and output data (OUT) is controllable via the scan chain, while the output control and
actual pin value is observable. The contents of the latched outputs of the Boundary-scan chain
is driven out as soon as the JTAG IR-Register is loaded with the EXTEST instruction.
• At the TMS input, apply the sequence 1, 1, 0, 0 at the rising edges of TCK to enter the Shift
• Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. The instruction is latched
• ·At the TMS input, apply the sequence 1, 0, 0 at the rising edges of TCK to enter the Shift
• Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. If the selected Data
Instruction Register - Shift-IR state. While in this state, shift the four bits of the JTAG
instructions into the JTAG Instruction Register from the TDI input at the rising edge of TCK.
The TMS input must be held low during input of the 3 LSBs in order to remain in the Shift-IR
state. The MSB of the instruction is shifted in when this state is left by setting TMS high.
While the instruction is shifted in from the TDI pin, the captured IR-state 0x01 is shifted out
on the TDO pin. The JTAG Instruction selects a particular Data Register as path between TDI
and TDO and controls the circuitry surrounding the selected Data Register.
onto the parallel output from the Shift Register path in the Update-IR state. The Exit-IR,
Pause-IR, and Exit2-IR states are only used for navigating the state machine.
Data Register - Shift-DR state. While in this state, upload the selected Data Register
(selected by the present JTAG instruction in the JTAG Instruction Register) from the TDI input
at the rising edge of TCK. In order to remain in the Shift-DR state, the TMS input must be
held low during input of all bits except the MSB. The MSB of the data is shifted in when this
state is left by setting TMS high. While the Data Register is shifted in from the TDI pin, the
parallel inputs to the Data Register captured in the Capture-DR state is shifted out on the
TDO pin.
Register has a latched parallel-output, the latching takes place in the Update-DR state. The
Exit-DR, Pause-DR, and Exit2-DR states are only used for navigating the state machine.
Figure 28-1
depend on the signal present on
XMEGA A
339