AT91SAM9XE512-CU Atmel, AT91SAM9XE512-CU Datasheet - Page 256

• Manufacturer Part Number: AT91SAM9XE512-CU
• Description: MCU ARM9 512K FLASH 217-BGA
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91SAM9XE512-CU

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 180MHz
• Connectivity: EBI/EMI, Ethernet, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 96
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 56K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 217-LFBGA
• Package: 217LFBGA
• Device Core: ARM926EJ-S
• Family Name: 91S
• Maximum Speed: 180 MHz
• Operating Supply Voltage: 1.8|2.5|3.3 V
• Data Bus Width: 32 Bit
• Number Of Programmable I/os: 96
• Interface Type: EBI/Ethernet/SPI/TWI/USART/USB
• On-chip Adc: 4-chx10-bit
• Number Of Timers: 6
• Processor Series: AT91SAMx
• Core: ARM926EJ-S
• Data Ram Size: 32 KB
• Maximum Clock Frequency: 180 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, KSK-AT91SAM9XE-PL, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91SAM-ICE, AT91-ISP, AT91SAM9XE-EK
• Minimum Operating Temperature: - 40 C
• For Use With: AT91SAM9XE-EK - KIT EVAL FOR AT91SAM9XEAT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

24.6.4
Register Name:
Address:
Access Type:
Reset Value:
• LPCB: Low-power Configuration Bits
• PASR: Partial Array Self-refresh (only for low-power SDRAM)
PASR parameter is transmitted to the SDRAM during initialization to specify whether only one quarter, one half or all banks
of the SDRAM array are enabled. Disabled banks are not refreshed in self-refresh mode. This parameter must be set
according to the SDRAM device specification.
• TCSR: Temperature Compensated Self-Refresh (only for low-power SDRAM)
TCSR parameter is transmitted to the SDRAM during initialization to set the refresh interval during self-refresh mode
depending on the temperature of the low-power SDRAM. This parameter must be set according to the SDRAM device
specification.
• DS: Drive Strength (only for low-power SDRAM)
DS parameter is transmitted to the SDRAM during initialization to select the SDRAM strength of data output. This parame-
ter must be set according to the SDRAM device specification.
6254C–ATARM–22-Jan-10
00
01
10
11
31
23
15
–
–
–
7
–
SDRAMC Low Power Register
Low Power Feature is inhibited: no Power-down, Self-refresh or Deep Power-down command is issued to
the SDRAM device.
The SDRAM Controller issues a Self-refresh command to the SDRAM device, the SDCLK clock is
deactivated and the SDCKE signal is set low. The SDRAM device leaves the Self Refresh Mode when
accessed and enters it after the access.
The SDRAM Controller issues a Power-down Command to the SDRAM device after each access, the
SDCKE signal is set to low. The SDRAM device leaves the Power-down Mode when accessed and
enters it after the access.
The SDRAM Controller issues a Deep Power-down command to the SDRAM device. This mode is
unique to low-power SDRAM.
30
22
14
SDRAMC_LPR
0xFFFFEA10
Read-write
0x0
–
–
–
6
PASR
29
21
13
–
–
5
TIMEOUT
AT91SAM9XE128/256/512 Preliminary
28
20
12
–
–
4
27
19
11
–
–
3
–
DS
26
18
10
–
–
2
–
25
17
–
–
9
1
TCSR
LPCB
24
16
–
–
8
0
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