AT91SAM9XE512-CU Atmel, AT91SAM9XE512-CU Datasheet - Page 27

MCU ARM9 512K FLASH 217-BGA

AT91SAM9XE512-CU

Manufacturer Part Number
AT91SAM9XE512-CU
Description
MCU ARM9 512K FLASH 217-BGA
Manufacturer
Atmel
Series
AT91SAMr
Datasheet

Specifications of AT91SAM9XE512-CU

Core Processor
ARM9
Core Size
16/32-Bit
Speed
180MHz
Connectivity
EBI/EMI, Ethernet, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
56K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
217-LFBGA
Package
217LFBGA
Device Core
ARM926EJ-S
Family Name
91S
Maximum Speed
180 MHz
Operating Supply Voltage
1.8|2.5|3.3 V
Data Bus Width
32 Bit
Number Of Programmable I/os
96
Interface Type
EBI/Ethernet/SPI/TWI/USART/USB
On-chip Adc
4-chx10-bit
Number Of Timers
6
Processor Series
AT91SAMx
Core
ARM926EJ-S
Data Ram Size
32 KB
Maximum Clock Frequency
180 MHz
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-ARM-2M, KSK-AT91SAM9XE-PL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
AT91SAM-ICE, AT91-ISP, AT91SAM9XE-EK
Minimum Operating Temperature
- 40 C
For Use With
AT91SAM9XE-EK - KIT EVAL FOR AT91SAM9XEAT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT91SAM9XE512-CU
Manufacturer:
NEC
Quantity:
201
Part Number:
AT91SAM9XE512-CU
Manufacturer:
Atmel
Quantity:
10 000
Part Number:
AT91SAM9XE512-CU
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
8.2.3
8.2.4
8.2.5
6254C–ATARM–22-Jan-10
SDRAM Controller
Error Corrected Code Controller
I/O Drive Selection
The purpose of this control is to adapt the signal to the frequency. Two bits enable the user to
select High or Low Drive for memory data/addresses/control signals.
Setting the EBI_DRIVE field [17:16] in the EBI Chip Select Assignement Register (EBI_CSA)
located in the Chip Select Interface of the Bus Matrix, enables control of the EBI.
• Supported devices:
• Numerous configurations supported
• Programming facilities
• Energy-saving capabilities
• Error detection
• SDRAM Power-up Initialization by software
• CAS Latency of 1, 2 and 3 supported
• Auto Precharge Command not used
• Hardware error corrected code generation
• Supports NAND Flash and SmartMedia devices with 8- or 16-bit data path
• Supports NAND Flash and SmartMedia with page sizes of 528,1056, 2112 and 4224 bytes
• Supports 1 bit correction for a page of 512, 1024, 2112 and 4096 bytes with 8- or 16-bit data
• Supports 1 bit correction per 512 bytes of data for a page size of 512, 2048 and 4096 bytes
• Supports 1 bit correction per 256 bytes of data for a page size of 512, 2048 and 4096 bytes
specified by software
path
with 8-bit data path
with 8-bit data path
– Standard and Low Power SDRAM (Mobile SDRAM)
– 2K, 4K, 8K Row Address Memory Parts
– SDRAM with two or four Internal Banks
– SDRAM with 16- or 32-bit Data Path
– Word, half-word, byte access
– Automatic page break when Memory Boundary has been reached
– Multibank Ping-pong Access
– Timing parameters specified by software
– Automatic refresh operation, refresh rate is programmable
– Self-refresh, power down and deep power down modes supported
– Refresh Error Interrupt
– Detection and correction by software
AT91SAM9XE128/256/512 Preliminary
27

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