P89LPC9341FDH,512 NXP Semiconductors, P89LPC9341FDH,512 Datasheet - Page 65

• Manufacturer Part Number: P89LPC9341FDH,512
• Description: IC 80C51 MCU FLASH 8K 28-TSSOP
• Manufacturer: NXP Semiconductors
• Series: LPC900r

Specifications of P89LPC9341FDH,512

• Program Memory Type: FLASH
• Program Memory Size: 8KB (8K x 8)
• Package / Case: 28-TSSOP
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 26
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x8b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: P89LPC
• Core: 80C51
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 18 MHz
• Number Of Programmable I/os: 23
• Number Of Timers: 2
• Operating Supply Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (8 bit, 4 Channel)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-1758 - BOARD EVAL FOR LPC93X MCU FAMILY
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935288632512

NXP Semiconductors
9. Limiting values
Table 11.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
P89LPC9331_9341_9351_9361
Product data sheet
Symbol
T
T
I
I
I
V
V
P
V
OH(I/O)
OL(I/O)
I/Otot(max)
amb(bias)
stg
xtal
n
tot(pack)
ESD
The following applies to
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
b) Parameters are valid over ambient temperature range unless otherwise specified. All voltages are with respect to V
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
otherwise noted.
Limiting values
Parameter
bias ambient temperature
storage temperature
HIGH-level output current per
input/output pin
LOW-level output current per
input/output pin
maximum total input/output current
crystal voltage
voltage on any other pin
total power dissipation (per package)
electrostatic discharge voltage
Table
Fig 25. Frequency vs. supply voltage
11:
All information provided in this document is subject to legal disclaimers.
system frequency
(MHz)
Rev. 5 — 10 January 2011
Conditions
on XTAL1, XTAL2 pin to V
except XTAL1, XTAL2 to V
based on package heat
transfer, not device power
consumption
human body model; all pins
charged device model; all
pins
18
12
8-bit microcontroller with accelerated two-clock 80C51 core
P89LPC9331/9341/9351/9361
2.4
[1]
2.7
SS
SS
V
DD
[2]
3.0
(V)
Min
−55
−65
-
-
-
-
−0.5
-
−3000
−700
3.3
002aae351
3.6
Max
+125
+150
20
20
100
V
+5.5
1.5
+3000
+700
© NXP B.V. 2011. All rights reserved.
DD
+ 0.5
SS
unless
Unit
°C
°C
mA
mA
mA
V
V
W
V
V
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