HD64F2612FA20 Renesas Electronics America, HD64F2612FA20 Datasheet - Page 158

IC H8S MCU FLASH 128K 80QFP

HD64F2612FA20

Manufacturer Part Number
HD64F2612FA20
Description
IC H8S MCU FLASH 128K 80QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2612FA20

Core Processor
H8S/2600
Core Size
16-Bit
Speed
20MHz
Connectivity
CAN, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
43
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
80-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2612FA20
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Part Number:
HD64F2612FA20J
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Section 8 Data Transfer Controller (DTC)
Table 8.5
Mode
Normal
Repeat
Block transfer
Legend:
N: Block size (initial setting of CRAH and CRAL)
Table 8.6
Bus width
Access states
Execution
status
Note:
The number of execution states is calculated from using the formula below. Note that Σ is the sum
of all transfers activated by one activation event (the number in which the CHNE bit is set to 1,
plus 1).
For example, when the DTC vector address table is located in the on-chip ROM, normal mode is
set, and data is transferred from on-chip ROM to an internal I/O register, then the time required for
the DTC operation is 13 states. The time from activation to the end of the data write is 10 states.
Rev. 7.00 Sep. 11, 2009 Page 122 of 566
REJ09B0211-0700
Object to be Accessed
* Cannot be used in this LSI.
Number of execution states = I · S
Vector read
Register information
read/write
Byte data read
Word data read
Byte data write
Word data write
Internal operation
DTC Execution Status
Number of States Required for Each Execution Status
Vector Read
I
1
1
1
S
S
S
S
S
S
S
Register Information
Read/Write
J
6
6
6
I
J
K
K
L
L
M
RAM
Chip
On-
32
1
1
1
1
1
1
I
+ Σ (J · S
ROM
Chip
On-
16
1
1
1
1
1
1
J
On-Chip I/O
+ K · S
Registers
8
2
2
4
2
4
Data Read
K
1
1
N
K
16
+ L · S
2
2
2
2
2
1
L
) + M · S
2
4
2
4
2
4
Data Write
L
1
1
N
External Devices *
8
6 + 2m
6 + 2m
6 + 2m
3 + m
3 + m
3
M
Internal
Operations
M
3
3
3
2
2
2
2
2
2
16
3 + m
3 + m
3 + m
3 + m
3 + m
3

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