HD64F2612FA20 Renesas Electronics America, HD64F2612FA20 Datasheet - Page 547

IC H8S MCU FLASH 128K 80QFP

HD64F2612FA20

Manufacturer Part Number
HD64F2612FA20
Description
IC H8S MCU FLASH 128K 80QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2612FA20

Core Processor
H8S/2600
Core Size
16-Bit
Speed
20MHz
Connectivity
CAN, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
43
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
80-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2612FA20
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Part Number:
HD64F2612FA20J
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
21.3.3
Table 21.6 lists the timing of on-chip supporting modules.
Table 21.6 Timing of On-Chip Supporting Modules
Conditions: V
Item
I/O port
TPU
SCI
Timing of On-Chip Supporting Modules
Output data delay timet
Input data setup time t
Input data hold time
Timer output delay
time
Timer input setup time t
Timer clock input
setup time
Timer
clock
pulse
width
Input
clock
cycle
Input clock pulse widtht
Input clock rise time
Input clock fall time
Transmit data delay
time
Receive data setup
time (synchronous)
Receive data hold
time (synchronous)
T
specifications)
a
CC
= –20°C to +75°C (regular specifications), T
= 4.5 V to 5.5 V, AV
Single
edge
Both
edges
Asynchro-
nous
Synchro-
nous
Symbol
t
t
t
t
t
t
t
t
t
t
t
PWD
PRS
PRH
TOCD
TICS
TCKS
SCKW
SCKr
SCKf
TXD
RXS
RXH
Scyc
TCKWH
TCKWL
CC
= 4.5 V to 5.5 V, V
Min.
30
30
30
30
0.4
50
50
1.5
2.5
4
6
Rev. 7.00 Sep. 11, 2009 Page 511 of 566
Max.
50
50
0.6
1.5
1.5
50
SS
a
Section 21 Electrical Characteristics
= –40°C to +85°C (wide-range
= AV
SS
Unit
ns
ns
ns
t
t
ns
t
t
Scyc
cyc
cyc
cyc
= 0, φ = 4 MHz to 20 MHz,
REJ09B0211-0700
Figure 21.6
Figure 21.7
Figure 21.8
Figure 21.10
Test Conditions
Figure 21.9

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