HD64F2612FA20 Renesas Electronics America, HD64F2612FA20 Datasheet - Page 503

IC H8S MCU FLASH 128K 80QFP

HD64F2612FA20

Manufacturer Part Number
HD64F2612FA20
Description
IC H8S MCU FLASH 128K 80QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2612FA20

Core Processor
H8S/2600
Core Size
16-Bit
Speed
20MHz
Connectivity
CAN, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
43
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
80-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2612FA20
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Part Number:
HD64F2612FA20J
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Figure 18.6 Programming/Erasing Flowchart Example in User Program Mode
Note: *
Branch to user program/erase control
Transfer user program/erase control
Execute user program/erase control
Branch to flash memory application
program (flash memory rewrite)
Do not constantly apply a high level to the FWE pin. Only apply a high level to the FWE pin
when programming or erasing the flash memory. To prevent excessive programming or excessive
erasing, while a high level is being applied to the FWE pin, activate the watchdog timer in case of
handling CPU runaways.
program to RAM
program in RAM
Program/erase?
FWE = high *
Reset-start
Clear FWE
program
Yes
No
Branch to flash memory application
Rev. 7.00 Sep. 11, 2009 Page 467 of 566
program
REJ09B0211-0700
Section 18 ROM

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