HD64F2319VTE25 Renesas Electronics America, HD64F2319VTE25 Datasheet - Page 688

IC H8S MCU FLASH 512K 100-QFP

HD64F2319VTE25

Manufacturer Part Number
HD64F2319VTE25
Description
IC H8S MCU FLASH 512K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of HD64F2319VTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
71
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2319VTE25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 17 ROM
• The RxD1 and TxD1 pins should be pulled up on the board.
• Before branching to the programming control program (RAM area H'FFE400 to H'FFFBFF),
• Boot mode can be entered by making the pin settings shown in table 17.30 and executing a
• If the mode pin input levels are changed (for example, from low to high) during a reset, the
Notes: 1. Mode pins input must satisfy the mode programming setup time (t
17.15.2 User Program Mode
When set to user program mode, the chip can program and erase its flash memory by executing a
user program/erase control program. Therefore, on-board reprogramming of the on-chip flash
memory can be carried out by providing an on-board means to supply programming data, and
storing a program/erase control program in part of the program area if necessary.
To select user program mode, select a mode that enables the on-chip flash memory (mode 6 or 7).
In this mode, on-chip supporting modules other than flash memory operate as they normally
would in modes 6 and 7.
Rev.7.00 Feb. 14, 2007 page 654 of 1108
REJ09B0089-0700
the chip terminates transmit and receive operations by the on-chip SCI (channel 1) (by clearing
the RE and TE bits in SCR to 0), but the adjusted bit rate value remains set in BRR. The
transmit data output pin, TxD1, goes to the high-level output state (P31DDR = 1, P31DR = 1).
The contents of the CPU’s internal general registers are undefined at this time, so these
registers must be initialized immediately after branching to the programming control program.
In particular, since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area
must be specified for use by the programming control program.
Initial settings must also be made for the other on-chip registers.
reset-start.
Boot mode can be cleared by driving the reset pin low, waiting at least 20 states, then setting
the mode pins, and executing reset release *
overflow reset.
Do not change the mode pin input levels in boot mode.
state of ports with multiplexed address functions and bus control output pins (AS, RD, HWR)
will change according to the change in the microcomputer’s operating mode *
Therefore, care must be taken to make pin settings to prevent these pins from becoming output
signal pins during a reset, or to prevent collision with signals outside the microcomputer.
2. See section 8, I/O Ports.
respect to the reset release timing.
1
. Boot mode can also be cleared by a WDT
MDS
2
= 200 ns) with
.

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