HD64F2319VTE25 Renesas Electronics America, HD64F2319VTE25 Datasheet - Page 826

• Manufacturer Part Number: HD64F2319VTE25
• Description: IC H8S MCU FLASH 512K 100-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of HD64F2319VTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 71
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 17 ROM
Table 17.73 (4) Usable Area for Erasure in User Boot Mode
Rev.7.00 Feb. 14, 2007 page 792 of 1108
REJ09B0089-0700
Note: * Switching FMATS by a program in the on-chip RAM enables this area to be used.
Operation for Selection of
On-Chip Program to be
Downloaded
Operation for Writing H'A5
to Key Register
Execution of Writing SC0 =
1 to FCCS (Download)
Operation for Key Register
Clear
Judgement of Download
Result
Operation for Download
Error
Operation for Settings of
Default Parameter
Execution of Initialization
Judgement of Initialization
Result
Operation for Initialization
Error
Operation for Interrupt
Inhibit
Switching MATs by
FMATS
Operation for Writing H'5A
to Key Register
Operation for Settings of
Erasure Parameter
Execution of Erasure
Judgement of Erasure
Result
Operation for Erasure
Error
Operation for Key Register
Clear
Switching MATs by
FMATS
Item
On-Chip
RAM
Storable/Executable Area
User
Boot
MAT
× *
×
×
×
×
×
×
×
×
×
External Space
(Expanded
Mode)
×
×
×
×
×
User
MAT
Selected MAT
Boot
User
MAT
Storage Area
Embedded
Program