HD64F2319VTE25 Renesas Electronics America, HD64F2319VTE25 Datasheet - Page 79

• Manufacturer Part Number: HD64F2319VTE25
• Description: IC H8S MCU FLASH 512K 100-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of HD64F2319VTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 71
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Table 2.3
Type
Data transfer
Instructions Classified by Function
Instruction
MOV
MOVFPE
MOVTPE
POP
PUSH
LDM
STM
Size *
B/W/L
B
B
W/L
W/L
L
L
1
Function
(EAs) → Rd, Rs → (Ead)
Moves data between two general registers or between a
general register and memory, or moves immediate data
to a general register.
Pops a register from the stack. POP.W Rn is identical to
MOV.W @SP+, Rn. POP.L ERn is identical to MOV.L
@SP+, ERn.
Rn → @–SP
Pushes a register onto the stack. PUSH.W Rn is
identical to MOV.W Rn, @–SP. PUSH.L ERn is identical
to MOV.L ERn, @–SP.
@SP+ → Rn (register list)
Pops two or more general registers from the stack.
Rn (register list) → @–SP
Pushes two or more general registers onto the stack.
Cannot be used in the H8S/2319 Group.
Cannot be used in the H8S/2319 Group.
@SP+ → Rn
Rev.7.00 Feb. 14, 2007 page 45 of 1108
REJ09B0089-0700
Section 2 CPU