HD64F2319VTE25 Renesas Electronics America, HD64F2319VTE25 Datasheet - Page 731
HD64F2319VTE25
Manufacturer Part Number
HD64F2319VTE25
Description
IC H8S MCU FLASH 512K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of HD64F2319VTE25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
71
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F2319VTE25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Table 17.49 Register/Parameter and Target Mode
Programming/
erasing interface
registers
Programming/
erasing interface
parameter
RAM emulation
Notes: 1. The setting is required when programming or erasing user MAT in user boot mode.
17.23
17.23.1 Programming/Erasing Interface Register
The programming/erasing interface registers are as described below. They are all 8-bit registers
that can be accessed in byte. Except for the FLER bit in FCCS, these registers are initialized at a
power-on reset, in hardware standby mode, or in software standby mode. The FLER bit is not
initialized in software standby mode.
2. The setting may be required according to the combination of initiation mode and read
Register Description of Flash Memory
target MAT.
FCCS
FPCS
PECS
FKEY
FMATS
FPFR
FPEFEQ
FMPAR
FMPDR
FEBS
RAMER
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Download
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Initiali-
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Program-
ming
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Rev.7.00 Feb. 14, 2007 page 697 of 1108
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1
Erasure
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1
Read
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REJ09B0089-0700
Section 17 ROM
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2
RAM
Emulation
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