WG82574IT S LBAC Intel, WG82574IT S LBAC Datasheet - Page 470
WG82574IT S LBAC
Manufacturer Part Number
WG82574IT S LBAC
Description
CONTROLLER, ENET, INTEL 82574IT, 64PQFN
Manufacturer
Intel
Datasheet
1.WG82574IT_S_LBAC.pdf
(490 pages)
Specifications of WG82574IT S LBAC
Ethernet Type
IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Supply Voltage Range
3V To 3.6V
Operating Temperature Range
-40°C To +85°C
Digital Ic Case Style
QFN
No. Of Pins
64
Package / Case
QFN
Interface Type
I2C, JTAG, PCI, SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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14.0
14.1
14.2
14.3
Note:
14.4
470
Thermal Design Considerations
Introduction
This section describes the 82574 thermal characteristics and suggested thermal
solutions. Use this section to properly design a thermal solution for systems
implementing the 82574.
Properly designed solutions provide adequate cooling to maintain the 82574 case
temperature (Tcase) at or below those listed in
by providing a low, local ambient temperature and creating a minimal thermal
resistance to that local ambient temperature. By maintaining the 82574 case
temperature at or below those recommended in this section, the 82574 will function
properly and reliably.
Intended Audience
The intended audience for this section is system design engineers using the 82574.
System designers are required to address component and system-level thermal
challenges as the market continues to adopt products with higher-speeds and port
densities. New designs might be required to provide better cooling solutions for silicon
devices depending on the type of system and target operating environment.
Measuring the Thermal Conditions
This section provides a method for determining the operating temperature of the 82574
in a specific system based on case temperature. Case temperature is a function of the
local ambient and internal temperatures of the component. This section specifies a
maximum allowable Tcase for the 82574.
Removal of the shield lid is required to measure the case temperature.
Thermal Considerations
Component temperature in a system environment is a function of the component,
board, and system thermal characteristics. The board/system-level thermal constraints
consist of the following:
• Local ambient temperature near the component
• Airflow over the component and surrounding board
• Physical constraints at, above, and surrounding the component that might limit the
size of a thermal enhancement
82574 GbE Controller—Thermal Design Considerations
Table
95. Ideally, this is accomplished
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