W83877ATG Nuvoton Technology Corporation of America, W83877ATG Datasheet - Page 192

• Manufacturer Part Number: W83877ATG
• Manufacturer: Nuvoton Technology Corporation of America

Specifications of W83877ATG

• Lead Free Status / RoHS Status: Supplier Unconfirmed

15. ORDERING INFORMATION
16. HOW TO READ THE TOP MARKING
The top marking of W83877ATF
The top marking of W83877ATG
1st line: Winbond logo
1st line: Winbond logo
2nd line: the type number: W83877ATF
3rd line: Tracking code
2nd line: the type number: W83877ATG; G means lead-free package
3rd line: Tracking code
W 83877ATF
W 83877ATG
220AC27039520
220AC27039520
inbond
inbond
220 : packages made in '02, week 20
A : assembly house ID; A means ASE, S means SPIL
C : IC revision; B means version B, C means version C
2 : wafers manufactured in Winbond FAB 2
7039520 : wafer production series lot number
220 : packages made in '02, week 20
A : assembly house ID; A means ASE, S means SPIL
C : IC revision; B means version B, C means version C
2 : wafers manufactured in Winbond FAB 2
W83877ATG
W83877ATF
PART NO.
220 A C 2 7039520
220 A C 2 7039520
- 185 -
W83877ATF/W83877ATG
Publication Release Date:November 2006
100-pin QFP
100-pin QFP
PACKAGE
Version 1.0