MD2433-D8G-V3Q18-X-P SanDisk, MD2433-D8G-V3Q18-X-P Datasheet - Page 2

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MD2433-D8G-V3Q18-X-P

Manufacturer Part Number
MD2433-D8G-V3Q18-X-P
Description
IC MDOC H1 8GB 115-FBGA
Manufacturer
SanDisk
Datasheet

Specifications of MD2433-D8G-V3Q18-X-P

Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
8G (1G x 8)
Speed
64ns
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-30°C ~ 85°C
Package / Case
115-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MD2433-D8G-V3Q18-X-P
Manufacturer:
SANDISK
Quantity:
18 120
Part Number:
MD2433-D8G-V3Q18-X-P
Manufacturer:
M-SYSTEM
Quantity:
363
Part Number:
MD2433-D8G-V3Q18-X-P
Manufacturer:
SanDisk
Quantity:
10 000
Boot Capability
Hardware Compatibility
TrueFFS
2
4-bit Error Detection Code/Error Correction
Code (EDC/ECC), based on a patented
combination of BCH and Hamming code
algorithms, tailored for NAND flash
technology
Guaranteed data integrity after power
failure
Transparent bad-block management
Dynamic and static wear-leveling
Programmable Boot Block with XIP
capability to replace boot ROM – 1KB
Download Engine (DE) for automatic
download of boot code from Programmable
Boot Block
Asynchronous Boot
Configurable interface: simple NOR-like or
multiplexed address/data interface
CPU compatibility, including:
Supports 8 and 16 bit architectures.
Full hard-disk read/write emulation for
transparent file system management
Patented TrueFFS
Dynamic and static wear-leveling
Texas Instruments (TI) OMAP, DBB
Intel XScale PXAxxx family
Infinion xGold family
Analog Devices (ADI) AD652x family
Freescale MX family
Emblaze ER4525
Renesas SH mobile
Qualcomm MSMxxxx
Hitachi SuperH™ SH-x
Flash file system management
Automatic bad block management
Data management to maximize the limit
of typical flash life expectancy
Dynamic virtual mapping
®
Software
Data Sheet, Rev. 1.1
Operating Environment
Power Requirements
Packaging
Capacity
Programming, duplicating, testing and
debugging tools available in source code
Wide OS support, including:
TrueFFS Software Development Kit (SDK)
for quick and easy support for proprietary
OSs, or OS-less environment
TrueFFS Boot Software Development Kit
(BDK)
Operating voltage:
Current Consumption
115-ball FBGA package: 12x18x1.4 mm
4 Gbit (512MB)
8 Gbit (1GB)
16 Gbit (2GB), cascading two mDOC H1
8Gb (1GB)
Symbian
Microsoft Windows Mobile
Palm
Nucleus
Linux
OSE
Core 2.7V – 3.6V
I/O 1.65V-1.95V or 2.5-3.6V (auto-
detect)
Active mode: 44 mA
Deep Power-Down mode: 25 µA
mDOC H1 4Gb (512MByte) and 8Gb (1GByte)
95-DT-1104-01

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