MD2433-D8G-V3Q18-X-P SanDisk, MD2433-D8G-V3Q18-X-P Datasheet - Page 39

• Manufacturer Part Number: MD2433-D8G-V3Q18-X-P
• Description: IC MDOC H1 8GB 115-FBGA
• Manufacturer: SanDisk

Specifications of MD2433-D8G-V3Q18-X-P

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 8G (1G x 8)
• Speed: 64ns
• Interface: Parallel
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -30°C ~ 85°C
• Package / Case: 115-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

7.
7.1
A typical RISC processor memory architecture is shown in Figure 9. It may include the following
devices:
•
•
•
•
•
39
mDOC H1: Contains the OS image, applications, registry entries, back-up data, user files and
data, etc. It can also be used to perform boot operation, thereby replacing the need for a
separate boot device.
CPU: mDOC H1 is compatible with all major CPUs in the mobile phone, Digital TV (DTV)
and Digital Still Camera (DSC) markets, including:
o
o
o
o
o
o
o
o
Boot Device: ROM or NOR flash that contains the boot code required for system initialization,
kernel relocation, loading the operating systems and/or other applications and files into the
RAM and executing them.
RAM/DRAM Memory: This memory is used for code execution.
Other Devices: A DSP processor, for example, may be used in a RISC architecture for
enhanced multimedia support.
D
General Guidelines
ARM-based CPUs
Texas Instruments OMAP, DBB
Intel XScale PXAxxx
Emblaze ER4525 application processor
SuperH SH
FreeScale MX family
Analog Devices (ADI) AD652x family.
Infineon xGOLD
ESIGN
* When used as a boot device, mDOC H1 eliminates the need for a dedicated boot ROM/NOR device.
C
ONSIDERATIONS
Figure 9: Typical System Architecture Using mDOC H1
Boot Device:
mDOC H1
ROM or
NOR *
Data Sheet, Rev. 1.1
*
Devices
DRAM
RAM/
Other
CPU
mDOC H1 4Gb (512MByte) and 8Gb (1GByte)
95-DT-1104-01