S9S12HY64J0MLH Freescale Semiconductor, S9S12HY64J0MLH Datasheet - Page 719

• Manufacturer Part Number: S9S12HY64J0MLH
• Description: MCU 64K FLASH AUTO 64-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of S9S12HY64J0MLH

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LCD, Motor control PWM, POR, PWM, WDT
• Number Of I /o: 50
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 64-LQFP
• Controller Family/series: S12
• No. Of I/o's: 50
• Ram Memory Size: 4KB
• Cpu Speed: 64MHz
• No. Of Timers: 2
• Rohs Compliant: Yes
• Processor Series: S12HY
• Core: HCS12
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: DEMO9S12HY64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

A.1.5
Absolute maximum ratings are stress ratings only. A functional operation under or outside those maxima
is not guaranteed. Stress beyond those limits may affect the reliability or cause permanent damage of the
device.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., either V
1. Beyond absolute maximum ratings device might be damaged.
2. All digital I/O pins are internally clamped to V
A.1.6
All ESD testing is in conformity with CDF-AEC-Q100 stress test qualification for automotive grade
integrated circuits. During the device qualification ESD stresses were performed for the Human Body
Model (HBM) and the Charge Device Model.
A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
Freescale Semiconductor
Num
10
11
12
13
1
2
3
4
5
6
7
8
9
I/O, regulator and analog supply voltage
Voltage difference V
Voltage difference V
Voltage difference V
Voltage difference V
Voltage difference V
Voltage difference V
Digital I/O input voltage
EXTAL, XTAL
Instantaneous maximum current
Instantaneous maximum current
Instantaneous maximum current
Storage temperature range
Single pin limit for all digital I/O pins
Single pin limit for all the power pins
Single pin limit for EXTAL, XTAL
Absolute Maximum Ratings
ESD Protection and Latch-up Immunity
DDX
SSX
DDX
SSX
DDM1,2
SSM1,2
to V
to V
to V
to V
MC9S12HY/HA-Family Reference Manual, Rev. 1.04
to V
to V
SSA
SSM1,2
DDA
DDM1,2
Table A-1. Absolute Maximum Ratings
Rating
SSA
DDA
SSX
(2)
and V
DDX
, or V
SSA
and V
DDA
SS35
Symbol
V
VDDXM
VSSXM
VDDMA
VSSMA
VDDXA
VSSXA
T stg
V
or V
V
DD35
I
I
I
DL
DL
ILV
D
IN
or V
(1)
SSM
DD35
and V
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
Min
–25
–25
–65
-50
).
DDM
Electrical Characteristics
Max
2.16
+25
+50
+25
155
6.0
0.3
0.3
0.3
0.3
0.3
0.3
6.0
Unit
mA
mA
mA
V
V
V
V
V
V
V
V
V
C
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