MPC8533EVTARJ Freescale Semiconductor, MPC8533EVTARJ Datasheet - Page 94

• Manufacturer Part Number: MPC8533EVTARJ
• Description: MPU POWERQUICC 783-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8533EVTARJ

• Processor Type: MPC85xx PowerQUICC III 32-Bit
• Speed: 1.067GHz
• Voltage: 1V
• Mounting Type: Surface Mount
• Package / Case: 783-FCPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

Thermal
20.3
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA)
package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The MPC8533E implements
several features designed to assist with thermal management, including the temperature diode. The
temperature diode allows an external device to monitor the die temperature in order to detect excessive
temperature conditions and alert the system; see
information.
The recommended attachment method to the heat sink is illustrated in
attached to the printed-circuit board with the spring force centered over the die. This spring force should
not exceed 10 pounds force (45 Newton).
The system board designer can choose between several types of heat sinks to place on the device. There
are several commercially-available heat sinks from the following vendors:
94
Aavid Thermalloy603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Advanced Thermal Solutions781-769-2800
89 Access Road #27.
Norwood, MA02062
Internet: www.qats.com
Alpha Novatech408-567-8082
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
Thermal Management Information
Figure 57. Package Exploded Cross-Sectional View with Several Heat Sink Options
MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Thermal Interface Material
Printed-Circuit Board
Adhesive or
Heat Sink
Heat Sink
Clip
Die
Section 20.3.4, “Temperature Diode,”
FC-PBGA Package
Figure
57. The heat sink should be
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