PCA9665PW,118 NXP Semiconductors, PCA9665PW,118 Datasheet - Page 90

• Manufacturer Part Number: PCA9665PW,118
• Description: IC CNTRLR PARALLEL/I2C 20TSSOP
• Manufacturer: NXP Semiconductors

Specifications of PCA9665PW,118

• Package / Case: 20-TSSOP
• Controller Type: I²C Bus Controller
• Interface: I²C
• Voltage - Supply: 2.3 V ~ 3.6 V
• Current - Supply: 100µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-4070-2; 935279244118; PCA9665PW-T; PCA9665PW-T

NXP Semiconductors
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17.1
17.2
17.3
17.4
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18.1
18.2
18.3
18.4
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21.1
21.2
21.3
21.4
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Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 70
Static characteristics. . . . . . . . . . . . . . . . . . . . 71
Dynamic characteristics . . . . . . . . . . . . . . . . . 72
Test information . . . . . . . . . . . . . . . . . . . . . . . . 79
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 80
Handling information. . . . . . . . . . . . . . . . . . . . 84
Soldering of SMD packages . . . . . . . . . . . . . . 84
Soldering of through-hole mount packages . 86
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 87
Legal information. . . . . . . . . . . . . . . . . . . . . . . 88
Contact information. . . . . . . . . . . . . . . . . . . . . 88
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Introduction to soldering . . . . . . . . . . . . . . . . . 84
Wave and reflow soldering . . . . . . . . . . . . . . . 84
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 84
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 85
Introduction to soldering through-hole
mount packages . . . . . . . . . . . . . . . . . . . . . . . 86
Soldering by dipping or by solder wave . . . . . 86
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 86
Package related soldering information . . . . . . 87
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 88
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Fm+ parallel bus to I
Document identifier: PCA9665_3
Date of release: 12 August 2008
PCA9665
2
C-bus controller
All rights reserved.