TXC-03453BROG Transwitch Corporation, TXC-03453BROG Datasheet - Page 90

• Manufacturer Part Number: TXC-03453BROG
• Manufacturer: Transwitch Corporation

Specifications of TXC-03453BROG

• Screening Level: Industrial
• Package Type: BGA
• Lead Free Status / Rohs Status: Compliant

September 2003
TL3M
TXC-03453B
PRELIMINARY TXC-03453B-MB, Ed. 3
PACKAGE INFORMATION
The TL3M device is packaged in a 324-lead plastic ball grid array package suitable for surface mounting, as
illustrated in Figure 38.
(A3)
Notes:
1. All dimensions are in millimeters. Values shown are for refer-
2. Identification of the solder ball A1 corner is contained within
3. Size of array: 22 x 22, JEDEC code MO-151-AAJ-1.
D
ence only.
this shaded zone. This package corner may be a 90° angle,
or chamfered for A1 identification.
D2
A2
E1/4
TRANSWITCH
TXC-03453BIOG
Note 2
D1/4
Figure 38. TL3M TXC-03453B Package Diagram
E2
E
DATA SHEET
- 90 of 96 -
A
22
21
20
19
18
17
16
15
14
13
12
11
10
A1
9
8
7
6
5
4
3
2
1
Dimension (Note 1)
AB
AA
Y
D1 (BSC)
E1 (BSC)
A3 (Ref.)
e (BSC)
b (Ref.)
W V U T R P N M L K J H G F E D C B
D2
A1
A2
E2
A
D
E
e
Bottom View
-E1-
19.45
19.45
2.02
0.40
1.12
0.50
Min
23.00
21.00
23.00
21.00
0.63
1.00
b
20.20
20.20
Max
2.44
0.60
1.22
0.62
A
-D1-