LCMXO2-2000HC-4FTG256C Lattice, LCMXO2-2000HC-4FTG256C Datasheet - Page 84

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LCMXO2-2000HC-4FTG256C

Manufacturer Part Number
LCMXO2-2000HC-4FTG256C
Description
FPGA - Field Programmable Gate Array 2112 LUTs 207 IO 3.3V 4 Spd
Manufacturer
Lattice
Datasheet

Specifications of LCMXO2-2000HC-4FTG256C

Rohs
yes
Number Of Gates
2 K
Embedded Block Ram - Ebr
74 Kbit
Number Of I/os
207
Maximum Operating Frequency
269 MHz
Operating Supply Voltage
1.14 V to 3.465 V, 2.375 V to 3.465 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
ftBGA-256
Distributed Ram
16 Kbit
Minimum Operating Temperature
0 C
Operating Supply Current
4.8 mA
Factory Pack Quantity
90
User Flash Memory - Ufm
80 Kbit

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LCMXO2-2000HC-4FTG256C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Part Number:
LCMXO2-2000HC-4FTG256C
Manufacturer:
LATTICE
Quantity:
20 000
For Further Information
For further information regarding logic signal connections for various packages please refer to the MachXO2
Device Pinout Files.
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Users must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the Thermal Management document to find the device/package
specific thermal values.
For Further Information
For further information regarding Thermal Management, refer to the following:
• TN1198,
• The Power Calculator tool is included with the Lattice design tools, or as a standalone download from
Thermal Management
www.latticesemi.com/software
Power Estimation and Management for MachXO2 Devices
document
4-8
MachXO2 Family Data Sheet
Pinout Information

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