MC9S12C128MFAE Freescale Semiconductor, MC9S12C128MFAE Datasheet - Page 652
![IC MCU 128K FLASH 25MHZ 48-LQFP](/photos/12/20/122066/mc9s12c128mfae_sml.jpg)
MC9S12C128MFAE
Manufacturer Part Number
MC9S12C128MFAE
Description
IC MCU 128K FLASH 25MHZ 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Specifications of MC9S12C128MFAE
Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
31
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
48-LQFP
Processor Series
S12C
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
4 KB
Interface Type
CAN/SCI/SPI
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
31
Number Of Timers
8
Operating Supply Voltage
3.3 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
M68EVB912C32EE
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Package
48LQFP
Family Name
HCS12
Maximum Speed
25 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12C128MFAE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Appendix A Electrical Characteristics
A.1.8
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
obtained from:
The total power dissipation can be calculated from:
Two cases with internal voltage regulator enabled and disabled must be considered:
652
1. Internal Voltage Regulator disabled
2. Internal voltage regulator enabled
P
P
T
T
T
P
Θ
J
J
A
D
INT
D
JA
Which is the sum of all output currents on I/O ports associated with V
For R
respectively
I
additionally contains the current flowing into the external loads with output high.
Which is the sum of all output currents on I/O ports associated with V
DDR
=
=
=
=
=
=
T
Junction Temperature, [°C ]
Ambient Temperature, [°C ]
=
P
R
Total Chip Power Dissipation, [W]
R
P
P
P
P
Power Dissipation and Thermal Characteristics
A
Package Thermal Resistance, [°C/W]
INT
IO
INT
IO
DSON
INT
DSON
is the current shown in
Chip Internal Power Dissipation, [W]
DSON
+
(
=
=
P
+
=
=
D
∑
∑
P
is valid:
I
I
i
•
IO
i
=
=
DDR
DD
Θ
R
R
V
----------- - for outputs driven low
V
----------------------------------- - for outputs driven high
I
JA
OL
DSON
DSON
⋅
OL
DD5
V
⋅
)
DD
V
I
;
OH
DDR
–
+
V
⋅
⋅
I
I
I
OH
IO i
IO i
DDPLL
+
I
2
2
;
DDA
MC9S12C-Family / MC9S12GC-Family
Table A-8
⋅
⋅
V
V
DDPLL
DDA
and not the overall current flowing into VDDR, which
Rev 01.24
+
I
DDA
⋅
V
DDA
DDX
DDX
and V
and V
Freescale Semiconductor
DDM
DDR
J
) in °C can be
.
.
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