ML610Q412P-NNNTB03A7 Rohm Semiconductor, ML610Q412P-NNNTB03A7 Datasheet - Page 219

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ML610Q412P-NNNTB03A7

Manufacturer Part Number
ML610Q412P-NNNTB03A7
Description
MCU 8BIT 16K FLASH 120-TQFP
Manufacturer
Rohm Semiconductor

Specifications of ML610Q412P-NNNTB03A7

Core Processor
nX-U8/100
Core Size
8-Bit
Speed
625kHz
Connectivity
I²C, SSP, UART/USART
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
14
Program Memory Size
16KB (8K x 16)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.1 V ~ 3.6 V
Data Converters
A/D 2x12b, 2x24b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ML610Q412P-NNNTB03A7
Manufacturer:
ROHM
Quantity:
750
Part Number:
ML610Q412P-NNNTB03A7
Manufacturer:
Rohm Semiconductor
Quantity:
10 000
15.3.3
Figure 15-7 shows the operation waveforms of the SDA and SCL signals and the I20BB flag. Table 15-1 shows the
relationship between communication speeds and HSCLK clock counts.
Note
- The HSCLK clock count is set so that the communication speed may be set to 50kbps when HSCLK is 500kHz.
φ: Period of high-speed clock (HSCLK)
Communication speed
Standard mode
SDA
SCL
I20BB
50 kbps
Table 15-1 Relationship between Communication Speeds and HSCLK Clock Counts
Operation Waveforms
Figure 15-7 Operation Waveforms of SDA and SCL Signals and I20BB Flag
t
HD:STA
Start condition
t
LOW
t
No reduction
(I20DW1, 0)
CYC
reduction
Speed
tHD:DAT
t
10φ
CYC
t
HIGH
t
HD:STA
15 – 13
ML610Q411/ML610Q412/ML610Q415 User’s Manual
Repeated condition
t
t
LOW
SU:STA
t
HD:DAT
t
t
SU:DAT
HIGH
Chapter 15 I
t
SU:STA
t
t
SU:DAT
SU:STO
Stop condition
2
C Bus Interface
t
SU:STO
t
BUF
t
BUF

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